The Right Approach: Electro-Tek—A Williams Family Legacy, Part 2
Alpha Insights, Performance by Design: Understanding Heat at the Core of Every Design
It’s Only Common Sense: Excuses Don’t Pay Invoices
TCT Circuit Supply and Electra Polymers Announce New Strategic Partnership
March 12, 2025 | Electra Polymers LtdEstimated reading time: Less than a minute
TCT Circuit Supply (TCS) is excited to announce a new strategic partnership with Electra Polymers, a global leader in advanced specialty polymer products. Effective April 1, 2025, this collaboration enables TCS to promote Electra’s world-class lineup of cutting-edge polymers, essential for manufacturing mission-critical, advanced technology printed circuit boards (PCBs) used across the electronics industry in the Minneapolis area, as well as Western Wisconsin, the Upper Peninsula of Michigan and the entire Eastern seaboard. Aside from the well-known EMP 110 Photoimageable Soldermask, TCS will also be promoting the world leading, EMJ 110 Inkjet Soldermask.
The partnership with Electra Polymers perfectly complements TCS’s recently established relationship with Notion Systems, a leading manufacturer of industrial inkjet equipment. Together, these alliances reinforce TCS’s commitment to providing state-of-the-art materials and solutions that drive innovation and efficiency in PCB manufacturing.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
11/12/2025 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform.
MKS Reports Q3 2025 Financial Results
11/06/2025 | Globe NewswireMKS Inc., a global provider of enabling technologies that transform our world, reported its financial results for the third quarter of 2025.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.