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We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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TCT Circuit Supply and Electra Polymers Announce New Strategic Partnership
March 12, 2025 | Electra Polymers LtdEstimated reading time: Less than a minute
TCT Circuit Supply (TCS) is excited to announce a new strategic partnership with Electra Polymers, a global leader in advanced specialty polymer products. Effective April 1, 2025, this collaboration enables TCS to promote Electra’s world-class lineup of cutting-edge polymers, essential for manufacturing mission-critical, advanced technology printed circuit boards (PCBs) used across the electronics industry in the Minneapolis area, as well as Western Wisconsin, the Upper Peninsula of Michigan and the entire Eastern seaboard. Aside from the well-known EMP 110 Photoimageable Soldermask, TCS will also be promoting the world leading, EMJ 110 Inkjet Soldermask.
The partnership with Electra Polymers perfectly complements TCS’s recently established relationship with Notion Systems, a leading manufacturer of industrial inkjet equipment. Together, these alliances reinforce TCS’s commitment to providing state-of-the-art materials and solutions that drive innovation and efficiency in PCB manufacturing.
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DuPont Interconnect Materials Enabling Advancements in Aerospace & Defense, Next-Gen Automotive, and AI
03/19/2025 | DuPontDuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo.
Cadence Joins Intel Foundry Accelerator Design Services Alliance
03/17/2025 | Cadence Design SystemsCadence is expanding its collaboration with Intel Foundry by officially joining the Intel Foundry Accelerator Design Services Alliance! This collaboration amplifies both companies' efforts to drive innovation, support advanced chip design, and solidify Intel Foundry as a leader in cutting-edge semiconductor solutions.
TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
03/13/2025 | TSMCMediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
Critical Manufacturing to Show You Might Need a New MES for Making Industry 4.0 A Reality at IPC APEX EXPO 2025
03/10/2025 | Critical ManufacturingCritical Manufacturing, a leader in advanced Manufacturing Execution Systems (MES) and a subsidiary of ASMPT, will show visitors to IPC APEX EXPO 2025 that the company’s MES - complete with extensive features specific to the electronics industry - can serve as a true Industry 4.0 platform. Any electronics manufacturer looking to turn its vision of digital transformation from concept into reality should prioritize visiting Critical Manufacturing at ASMPT SMT Booth 1813.