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Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
March 12, 2025 | Ventec International GroupEstimated reading time: 1 minute

Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations. But there’s a critical flaw: microvias fail far more often than plated through-holes in advanced designs, putting reliability on the line.
The root cause? Thermal mismatch. Differences in coefficient of thermal expansion (CTE) between the microvia fill material and surrounding dielectric create stress during thermal excursions, weakening the microvia barrel and cap. It gets worse, copper and epoxy expand and contract at different rates under thermal cycling, with epoxy’s higher CTE driving tensile stress on the copper cap plating. Repeated thermal cycling intensifies this fatigue initiating micro-cracks that spread into the microvia barrel or epoxy core, threatening the integrity of the entire interconnect.
Introducing VT-47LT: Next-Generation Low CTE prepreg for HDI Innovation
Ventec’s VT-47LT, a cutting-edge IPC 4101/126 prepreg that steps up to meet the demands of modern HDI technology, avoiding the need for time consuming and expensive requalification of alternative IPC4101 grades. With best-in-class Z-axis CTE, it delivers unrivalled reliability right where you need it. Its advanced low-CTE epoxy slashes thermal expansion mismatches, easing stress on microvia structures and tackling the persistent challenge of failures head-on.
Engineered with optimized properties, best-in-class Z-axis CTE and superior thermal resilience, VT-47LT cuts stress on microvias, reducing crack risks and boosting durability. It’s a game-changer delivering robust, long lasting HDI PCBs
Elevate your HDI projects with VT-47LT — where reliability meets innovation!
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Indium Expert to Present on Advancing Thermal Performance at TestConX China
10/21/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.