IMAPS and DPC: 21 Years of Elevating Technical Knowledge

Estimated reading time: 6 minutes

The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand.

Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.

This was my second year attending the show, and its ability to adapt and grow provides valuable opportunities for attendees to learn, network, and explore industry advancements.

Marcy LaRont: Brian, what is the mission of IMAPS and this conference specifically?

Brian Schieman: Per our mission statement, “IMAPS is the premier nonprofit membership association steering the communities associated with microelectronics, advanced packaging, interconnect, and assembly, by providing channels for communicating, educating, and interacting with academia, industry, and government.”

DPC is focused on advanced packaging education and presented via various program options. Our technical sessions this year took a look at Heterogeneous Integration; Emerging Technologies; Fan-Out, Wafer, Panel Level; and Flip Chip Packaging. We also had 16 Professional Development Courses to provide more in depth topical training for current and future workforce, as well as special sessions centered around AI technology. Our record number of student attendees and industry participants had the opportunity to learn from top industry experts.

LaRont: How has the DPC developed over time?

Schieman: This is the 21st year for our Device Packaging Conference. The inaugural conference was in Scottsdale, Arizona in 2005, and for two subsequent years. Starting in 2008, we met at the We-Ko-Pa Resort in Fountain Hills, which everybody loved, but we outgrew the space. We wanted to add technical tracks and more exhibitors and there just wasn't any room. Coming to the conference center at the Sheraton at Wild Horse Pass this year gave us a chance to do that, and next year, we will expand the meeting and exhibit space further at the same location. 

LaRont: Has the Exhibitor Hall always been part of the conference?

Schieman: Yes, and it has grown a lot. We started with a small number of tabletop exhibits in the early years, expanding to 66 full booths when the event relocated to We-Ko-Pa. This year we were able to accommodate 84 8x10 exhibits, and we are looking to expand next year to accommodate even more. During this year’s event, we also received a lot of interest from companies that would potentially exhibit next year for the first time.

LaRont: What do you feel the exhibitor hall brings to this event?

Schieman: Our international exhibition draws in and the entire industry supply chain and is an important complement to the international technical program we offer. For example, if you attend a technical presentation where the speaker discusses an adhesive used in a process, and then you walk the exhibit floor, you are likely to find a supplier offering relevant adhesives. You get to chat with them, learn about the properties of the adhesive, and connect with the companies and technical experts who can offer the solutions you’re looking for.

LaRont: I have been amazed by the level of technology and packaging architecture being discussed here. How is the focus different this year than last year?

Schieman: Before each conference, we look at what the hottest topics are and then put emphasis on those for our panel discussions and technical tracks. Our focus last year was on heterogeneous integration. Representatives of the Arizona Commerce Authority and the Greater Phoenix Economic Council were here to talk about all the local projects creating a buzz in Arizona. We also had an onshoring session focused on advanced packaging in U.S.

This year was very much focused on AI, covered by an evening panel and our Global Business Council (GBC) plenary session held Wednesday morning. We also hosted two full technical tracks on emerging technologies, which doubles what we had last year.

We were thrilled with our student participation this year from Arizona State and the University of Arizona. This summer, Chandler Arizona’s Hamilton High School is kicking off a new two-year CTE program in partnership with U of A. Centered on semiconductor manufacturing, it’s the first of its kind at the high school level. This is a great move for semiconductor packaging workforce development in Arizona.

LaRont: What did you hope the students would take away from this year’s show?

Schieman: The students are the future workforce for our industry. As such, our executive leadership and staff are dedicating more annual resources to expanding technical and networking opportunities for all students K-12 through PhD at our DPC and Symposium. We want as many students as possible to have exposure to the benefits of an industry association like this and feel the value of being in person to meet industry experts and learn about all of the cutting-edge technologies, as well as future career opportunities. More than 100 students participated in our professional development courses, and had the ability to directly ask questions of our subject matter industry experts. It’s a unique opportunity for students.

LaRont: Does IMAPS offer student memberships? 

Schieman: Yes, and the students are offered membership at no charge. We encourage student chapters across universities nationally where they can interact with our packaging industry locally, regionally and beyond.  

LaRont: In general, what did you hope attendees would gain from attending DPC?

Schieman: Our approach is always to provide an opportunity where you can come and add to what you already know, to expand your knowledge. Or you may be new to the industry wanting to master the basics. Others just want to understand how it all works and how it impacts their current work. And of course, there’s the student learning opportunity.  Everyone walks out of here more knowledgeable.

The other big benefit is the networking and we build in many opportunities for the attendees and speakers to connect.

LaRont: It’s really noticeable how you have built in those networking times where you don’t feel you’re being pulled away from something else.

Schieman: Yes, and the exhibit hall was very busy this year, partly because of what we've done with scheduling to allow for that.

LaRont: Can you speak to the growth of the conference over time?

Schieman: Last year was a record year for our DPC with 762 individuals in attendance. This year's attendance skyrocketed to 1,056. Our leadership is thrilled with the 39% increase in participation, and another record-setting conference for IMAPS.

LaRont: That's solid growth. Would you tell me about your Microelectronics Foundation.

Schieman: The mission of our Microelectronics Foundation's role is to support student activities related to the study of microelectronic packaging, interconnect and assembly. The Microelectronics Foundation supports student activities that cultivate an understanding of packaging, components, and assembly technologies.  Our Foundation generates important funds through direct giving campaigns, fundraising events, and other activities that go directly into our annual student programs.

The Foundation student programs include: sponsoring student papers, presentations, and poster competitions and awards in conjunction with all of our Conferences and local chapter meetings; providing funding for our student chapter meetings and activities; and funding the new “University Pilot Program” which funds large participation at DPC and Symposium (like we saw with ASU and UofA this week), as well as High School STEM participation at these events. Thanks to a  strong relationship with our official industry partner, 3D InCites, and through their large donation to our Foundation this year at DPC, we will be launching scholarship programs for students later this year. Simply put, our Foundation focuses on empowering students and growing the industry’s future workforce.

LaRont: That's good to hear. Is there anything else you’d like to share?

Schieman: We've received so much positive feedback about our event this year:  the location, the technical program, and the growth of the event. We have a dedicated committee that makes this all possible

LaRont: Congratulations on another great show.

Schieman: It's been a pleasure. Thank you, Marcy.