Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
March 13, 2025 | TSMCEstimated reading time: 1 minute
MediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process. This achievement makes it possible to integrate these two essential components into a system-on-chip (SoC) on an advanced RF process for wireless connectivity products, enabling a significantly smaller form factor while enjoying performance competitive with stand-alone modules.
The smaller area enabled by TSMC’s advanced N6RF+ technology can reduce the size of the wireless connectivity product module by a double-digit percentage. In addition, TSMC and MediaTek’s results showed significant improvement in power efficiency for the PMU compared with existing solutions, while iPA performance was competitive with benchmark products. As the world’s leading supplier of wireless connectivity solutions, MediaTek is well positioned to leverage these advancements to ensure top product performance as it shifts towards the next generation.
A direct result of MediaTek and TSMC’s close collaboration on Design-Technology Co-Optimization (DTCO), MediaTek drew on its product and design expertise to drive system specifications and technology requirements for this project, and TSMC enhanced its technology to enable differentiation in the products.
“After a year of working together on N6RF+, the test chip has exhibited excellent power efficiency gains," said Ching San Wu, Corporate Vice President at MediaTek. "By combining MediaTek's leadership in wireless technology and TSMC's expertise on DTCO, N6RF+ will become a competitive technology for RFSoC projects, creating a significant advantage in the industry."
“Successful DTCO between foundry and customer requires strong mutual trust and teamwork, and we are delighted in this joint accomplishment with a wireless connectivity leader like MediaTek,” said Lipen Yuan, senior director of Advanced Technology Business Development at TSMC. “This achievement on TSMC’s N6RF+ process shows how TSMC combines its leadership in advanced logic and broad portfolio of specialty technologies to provide differentiated solutions for customers’ products.”
Share on:
Suggested Items
Jabil Announces Appointment of New Director to the Board
04/21/2025 | Jabil Inc.Jabil Inc., a global engineering, supply chain, and manufacturing solutions provider, announced that Sujatha Chandrasekaran has been appointed to its Board of Directors.
NASA Aims to Fly First Quantum Sensor for Gravity Measurements
04/18/2025 | NASAA lumpy, colorful 3D model of the Earth against a black background, illustrating variations in gravity. North and South America are visible. Red areas show higher gravity, blue areas show lower gravity.
Hanon Systems Wins Third PACE Award for Visible-Light LED Photocatalyst Technology
04/18/2025 | PRNewswireHanon Systems, a leading global automotive thermal management supplier and subsidiary of Hankook & Company Group, has been named a winner of the 2025 PACE Awards. This marks the company's third win, making it the first Korean supplier to achieve this recognition.
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.