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Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication

03/13/2025 | John Watson -- Column: Elementary, Mr. Watson
At the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.

TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications

03/12/2025 | PRNewswire
Texas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.

INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates

03/12/2025 | iNEMI
If you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.

Insulectro Technology Village to Feature 35 Powerchats at IPC APEX EXPO 2025

03/11/2025 | Insulectro
Insulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, will present its popular and successful 13.5-minute PowerChats™ during this year’s IPC APEX EXPO at the Anaheim Convention Center, March 18-20, 2025.

Connect the Dots: Designing for Reality—Routing, Final Fab, and QC

03/06/2025 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we discussed several commonly used surface finishes, laying out the unique properties, the application process, and the associated pros and cons. Our final steps in the manufacturing process include routing, final inspection, and shipment.
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