Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

NHanced Semiconductors & University of Florida to Present on Advanced Packaging for Photonics at the 2026 SMTAI Conference

08/24/2026 | NHanced Semiconductors
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors vice-president Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

NHanced Semiconductors, UF to Present Advanced Photonics Packaging at SMTAI 2026

08/18/2026 | PRNewswire
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors Vice President Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

Quantinuum, Oracle Partner on Hybrid Quantum Computing

08/13/2026 | Quantinuum
Quantinuum, a leading quantum computing company, and Oracle announced a multi-year strategic partnership to bring quantum computing to Oracle Cloud Infrastructure (OCI). Under the partnership, OCI customers will be able to directly access Quantinuum’s Helios, the most accurate commercial quantum computer in the world,  through OCI’s quantum service, alongside OCI’s high-performance computing (HPC) and GPU infrastructure.

Molex Launches MiniMix Connectors for Humanoid Robotics

08/06/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, unveiled MiniMix Hybrid Power and Signal Connectors, a purpose-built interconnect platform designed to solve manufacturing and packaging challenges in next-generation humanoid robotics, autonomous mobile robots (AMRs) and advanced industrial automation systems.

Imec, EVG Demo Wafer-to-Wafer Hybrid Bonding at 200nm Pitch with Record Overlay Accuracy

05/28/2026 | PRNewswire
This week, at the 2026 IEEE Electronic Components and Technology Conference (ECTC), imec, a world-leading research and innovation hub in advanced semiconductor technologies, and EV Group (EVG), leading provider of semiconductor manufacturing equipment and process solutions, present a robust and highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad pitch, demonstrated on a test vehicle with routable interconnects.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in