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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/02/2026 | Marcy LaRont, I-Connect007
This week, I was fortunate to attend PCB West in Santa Clara, California, and was reminded of the idyllic weather of that part of California in the early fall. Attendance was high at the weeklong conference and one-day expo, allowing the show to maintain its place as one of the best events for PCB and PCB design. As always, it was great to see old friends and familiar faces. Stay tuned for more PCB West coverage.

3 Key Takeaways: Making ENIG and ENEPIG More Sustainable

09/30/2026 | I-Connect007
Gold prices have risen dramatically over the past decade, putting additional pressure on PCB fabricators to control costs without compromising the finishes their customers require. For ENIG and ENEPIG processes, however, the opportunity to reduce costs may also present an opportunity to improve sustainability. In its white paper, “Can ENIG & ENEPIG Process be Sustainable?” MacDermid Alpha Electronics Solutions provides guidelines for where the greatest opportunities exist to reduce gold consumption, chemistry use, energy demand, and waste while continuing to meet established performance requirements.

Learning With Leo: Where Reliability Actually Hides

08/05/2026 | Leo Lambert -- Column: Learning With Leo
In my many years of training, it’s funny to see what still surprises people. For example, they’re surprised that by the time the solder melts, most of what decides whether that joint survives has already happened before the iron and even before inspection. In fact, it’s even earlier than that. In my column last month, I argued that most soldering problems are really problems of interpretation, which leads to the materials themselves, and where reliability is won or lost. So, let’s talk about what we’re actually soldering today.

Trouble in Your Tank: At 40 GHz, Everything Matters, Part 2

07/27/2026 | Michael Carano -- Column: Trouble in Your Tank
In Part 1 of this article, we examined alternative solderable finishes for 5G/6G applications and reviewed literature on their performance at high frequencies. We found that certain solderable finishes are more susceptible to signal loss as frequency increases. These attenuation losses become increasingly significant at frequencies approaching and exceeding 40 GHz. Because of their high conductivity, silver and copper generally outperform finishes such as nickel and palladium. Taken together, these findings underscore the importance of finish selection in high-frequency applications.

Remtec Announces the Industry's Most Complete Suite of Plating Capabilities Including PCTF Technology for Advanced Electronic Packaging

07/07/2026 | Remtec
Remtec, a leader in advanced metallized ceramic substrates and electronic packaging solutions, is proud to announce the availability of what is believed to be the industry's most comprehensive portfolio of plating surface finish technologies for thick film ceramic circuits and advanced electronic assemblies.
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