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Elephantech: For a Greener Tomorrow

04/16/2025 | Marcy LaRont, PCB007 Magazine
Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.

ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing

04/16/2025 | SEMI
The 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.

ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing

04/15/2025 | SEMI
The 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.

MVTec HALCON Version Includes Deep Learning-Based Technology for Robust Bin Picking

04/15/2025 | MVTec
MVTec Software GmbH, a leading global manufacturer of machine vision software, is launching the new version of MVTec HALCON on May 27, 2025. Version 25.05 of the standard machine vision software includes numerous improvements as well as a new technology that combines deep learning algorithms with classic methods.

IPC President’s Award: Dr. Thomas Marktscheffel

04/15/2025 | Nolan Johnson, I-Connect007
At ASMPT SMT Solutions, Thomas Marktscheffel, director of product management software solutions, is responsible for the SMT line software portfolio. As a member and leader of several IPC committees, he is also a driving force for global industry standards such as IPC-2591 CFX and IPC-HERMES-9852, which make it possible to provide plug-and-play connectivity for intelligent SMT Factories. In 2015, he participated in the IPC-1782 A-team and subsequently joined the IPC-2591 CFX standard A-team, which became the new SMT industry communication standard following its first release in March 2019.
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