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Paige Fiet: From Emerging Engineer to Quality at TTM
March 19, 2025 | Marcy LaRont, PCB007 MagazineEstimated reading time: 1 minute
Editor’s note: This interview was originally recorded at IPC APEX EXPO 2024 as part of a series of interviews with IPC Emerging Engineers.
Paige Fiet is a graduate of the IPC Emerging Engineer program and now works at TTM Technologies in Logan, Utah. She was an IPC Student Board Member and has been a columnist for I-Connect007. She is a stellar example and an encouragement to other young engineers about how to be successful in your early career.
Paige, pleave give an overview of your career so far? Highlight any key factors that motivated you to pursue your role in engineering?
Paige Fiet: My dad was an engineer and as a kid, I remember going to visit him at his factory. I distinctly remember the day they put in a robot arm and how excited he was. I thought it would be like something from “The Jetsons,” but it was just an arm. I was freaked out at first, but he thought it was so cool. That day has stayed with me ever since.
In kindergarten, when everyone said they wanted to be a firefighter or a doctor, I said I wanted to be an engineer. Now, that may have changed a few times over the years, but by college, I knew I wanted to pursue electrical engineering.
I got into electronics through a PCB manufacturing class at Michigan Technological University in Houghton, and I really enjoyed it, so I joined the electronics club. Later, I applied and was selected as the IPC Student Board Member, which was an incredible learning opportunity for me.
Looking back at your career journey so far, what's been the most unexpected aspect or experience you’ve had?
I remember taking this English course in high school, and we had to write a weekly blog about whatever we wanted. I told myself that I would never write articles again. Now, I've been writing articles for I-Connect007 for about two years. It’s funny how these types of things work out.
Continue reading this article in the February 2025 issue of PCB007 Magazine.
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From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
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The Next Generation of Leadership: New Student Board Member Aubrey Smith
04/10/2026 | Marcy LaRont, I-Connect007At APEX EXPO 2026, the next generation of industry leadership was on full display with the introduction of Aubrey Smith, the Global Electronics Association’s newest Student Board Member. She’s a third-year electrical and electronics engineering student at the University of Georgia and a first-year participant in the Emerging Engineer Program. Aubrey represents the curiosity, initiative, and openness that define tomorrow’s innovators.
ASC Sunstone Circuits Implements Smart Parts Technology at Mulino Facility to Enhance PCB Manufacturing Efficiency
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Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
04/09/2026 | Dan Beaulieu -- Column: Dan's Biz BookshelfI just finished "The NVIDIA Way" by Tae Kim, and let me tell you, this isn’t just a book about a semiconductor company. It’s a book about conviction, stubborn vision, and, most of all, what happens when a leader refuses to think small. At the center of it all is Jensen Huang. Kim does a masterful job showing us that NVIDIA’s rise wasn’t luck, timing, or some Silicon Valley fairy dust. It was discipline and obsession. It was long-term thinking in a world addicted to quarterly results.
Meet Emerging Engineer Logan Bistodeau, IBM
04/09/2026 | Michelle Te, I-Connect007When he was growing up, Logan Bistodeau was always interested in how heavy machinery worked, so it was natural that he earned a mechanical engineering degree at Iowa State University. He originally grew up near the Twin Cities in Minnesota, now works for IBM, and is in his first year of the Emerging Engineer Program through the Global Electronics Association. I got to know Logan a little better at APEX EXPO 2026.