On the Line With… Releases Episode 11: Beyond UHDI—The Future of PCB Technology

Estimated reading time: 1 minute

I-Connect007 is pleased to announce the release of Episode 11 of On the Line With… American Standard Circuits: Ultra HDI. In this episode, host Nolan Johnson continues his conversation with ASC’s John Johnson, turning the spotlight toward the next decade of PCB innovation and what lies beyond today’s breakthroughs in Ultra High Density Interconnect (UHDI).

As Johnson explains, UHDI is on a trajectory that will define the future of electronics. Over the next several years, he notes, the industry will push confidently into the sub-25-micron feature range, with leading-edge boutique fabricators already demonstrating production at 5–6 microns. By 2030, this capability is expected to be more widely accessible, enabling the development of entirely new classes of electronic products.

The move to such extreme densities, however, is not without challenges. Johnson discusses the adhesion issues that naturally arise when features shrink to these dimensions, as well as the technologies and process innovations that fabricators are developing to overcome them. These solutions will be critical as designers push the limits of manufacturability in pursuit of lighter, faster, and increasingly compact devices.

Looking ahead, Johnson also examines how UHDI will reshape not only PCB fabrication but PCB function itself. As the industry evolves, PCBs are expected to adopt more semiconductor-like characteristics, incorporating embedded components and facilitating higher levels of system integration.

Episode 11 presents a clear and compelling view of what happens when PCBs continue to shrink, as well as the opportunities that will emerge as UHDI technology matures.

Catch up on the first 10 episodes of On the Line With… American Standard Circuits: Ultra HDI and listen to Episode 11 now on the I-Connect007 website or wherever you get your podcasts.