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Compal Launches New High-Performance GPU Server Platforms at GTC 2025
March 20, 2025 | PRNewswireEstimated reading time: 1 minute
At GTC 2025, Compal Electronics unveiled three new server platforms—SX420-2A, SX220-1N, and SX224-2A. All are built on NVIDIA MGX architecture and designed to inject powerful performance into enterprise-level AI, HPC, and high-load computing applications.
Discover Compal's flagship server, the SX420-2A and SX224-2A, powered by the industry-leading the NVIDIA RTX PRO™ 6000 Blackwell Server Edition
The SX420-2A 4U AI Server, making its debut, is engineered on the NVIDIA MGX architecture and optimized for deep AI-HPC applications. It features a flexible rack design that supports both EIA 19 "and ORV3 21" configurations, and it can be configured with up to 8 RTX PRO 6000 Blackwell GPUs—significantly boosting data center compute performance and resource utilization.
The SX224-2A 2U AI Server, integrates NVIDIA MGX architecture with an AMD x86 platform, offering highly flexible configuration options. It is engineered for future compatibility and optimized for diverse computing workloads—whether AI-HPC or AI-Graphics—allowing for tailored performance adjustments.
RTX PRO™ 6000 Blackwell GPU delivers top-tier performance: equipped with 96GB of ultra-fast GDDR7 memory and featuring a passively cooled thermal design, it ensures stable operation under extreme loads, providing revolutionary acceleration for both agentic and physical AI, as well as for scientific computing, graphics, and video applications. Combining this exceptional GPU performance, the SX420-2A and SX224-2A are undoubtedly one of the most competitive solutions in the industry.
SX220-1N: Scalable AI/HPC and Future-Proof Flexible Computing Platforms
SX220-1N 2U AI Server is designed for giant-scale AI and HPC applications, featuring the NVIDIA GH200 Grace Hopper™ Superchip and employing NVIDIA NVLink-C2C technology to deliver a coherent memory pool. This enables faster memory speeds and massive bandwidth to tackle large-scale computational tasks.
This comprehensive product lineup not only satisfies the rigorous requirements of diverse data center applications but also heralds a new era in enterprise computing technology. Industry professionals attending GTC 2025 are encouraged to visit Compal's booth (#1809) to explore its latest technological innovations in AI-HPC and high-performance computing.
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KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Electronics Manufacturing & Assembly Collaborative (EMAC) Announces Innovative Student Competition
07/15/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced the launch of the Bright Manufacturing Challenge 2025, a revolutionary hands-on competition that transforms how students experience electronics manufacturing and robotics engineering.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.