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Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance

05/14/2026 | Chandra Gupta -- Column: Below the Surface
If you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.

DuPont Wins 2026 IRI Innovation Excellence Award

05/13/2026 | DuPont
DuPont announced it was named the co-winner, along with Qnity Electronics, of the 2026 Innovation Excellence Award for Outstanding Innovative Culture from the Innovation Research Interchange (IRI), the innovation division of the National Association of Manufacturers (NAM).

Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components

05/13/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 

Saab Reveals Barracuda Poncho – Camouflage Protection for Soldiers

05/11/2026 | Saab
Saab has introduced its latest iteration of camouflage solutions, a poncho to protect individual soldiers from being detected by sensors operated by opposing forces across a variety of environments. 

Incap Group Reports Q1 2026 Revenue Growth and Completion of Lacon Acquisition

05/06/2026 | Incap
Incap estimates that the company’s revenue and comparable EBITA in 2026 will be clearly higher than in 2025. The estimates include the impact of Lacon’s acquisition and are given provided that unexpected events impacting Incap’s business environment do not occur.
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