Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
CommScope, Altice Labs Combine PON Technologies to Power Next-Gen FTTH Networks
March 21, 2025 | BUSINESS WIREEstimated reading time: 1 minute
CommScope, a global leader in network connectivity, announced the availability of its PON Evo™ products, a comprehensive suite of passive optical network (PON) active optical line terminal (OLT) solutions. The PON Evo suite is the result of a strategic partnership with Altice Labs, a leading R&D company, specializing in advanced telecommunications solutions.
CommScope’s PON Evo suite of products and vBNG Evo™ solution support a comprehensive, managed and orchestrated network transition strategy under a unified architecture. CommScope is integrating the Altice Labs line of advanced OLTs, software-defined network (SDN) management, and operational and business support systems into its existing portfolio.
As average revenue per user (ARPU) continues to decline, these benefits can facilitate migration from GPON to XGS-PON, and even 50G PON, all on the same infrastructure, with the integration of Altice Labs’ dual density XGS-PON SFP and dual XGS-PON SFP+ solutions, which significantly increases PON port density.
“By combining our existing virtual broadband network gateway (vBNG) and remote OLT solutions with Altice Labs’ technologies, we are now positioned to deliver a comprehensive and competitive FTTH portfolio giving our customers a single-source partner,” stated Guy Sucharczuk, SVP and president, Access Network Solutions, CommScope. “This expanded ecosystem is designed to meet the evolving needs of our customers as they deploy next-generation FTTH networks. These innovative PON solutions also expand upon our portfolio of hybrid fiber coax (HFC) solutions for customers who are implementing targeted FTTH deployments.”
“CommScope’s vBNG Evo solution is an excellent complement to our xPON technology,” said Joao Paulo Firmeza, general manager of Altice Labs. “This is a great mutually relevant collaboration whereby our offering is expanded with CommScope technologies, and they can now offer a full PON portfolio with the addition of Altice Labs’ technology. Together we create a formidable partnership aligned to meet our customers’ needs.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Cybord Announces Air-Gapped Visual AI Platform for Electronics Integrity and Hardware Cybersecurity
09/17/2025 | PRNewswireCybord, a leading provider of advanced visual-AI electronic component analytics solutions, announced the launch of its fully air-gapped platform, bringing advanced Visual AI inspection and traceability capabilities fully on-premises.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.