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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Breaking Down Barriers: Key Insights from John Mitchell’s Keynote
March 24, 2025 | Brittany Martin, I-Connect007Estimated reading time: 1 minute
At the core of IPC President and CEO John Mitchell’s keynote at IPC APEX EXPO on March 19, 2025, was a compelling message: electronics drive innovation, but true progress is powered by collaboration. In delivering his keynote, Mitchell challenged industry leaders in attendance with a crucial question, “How can we strike a balance between the growing push for protectionism and the undeniable need for global cooperation?”
Mitchell illustrated how AI, clean energy, and space exploration are pushing the limits of innovation, with electronics serving as the backbone of global progress. While groundbreaking discoveries may appear to happen in sudden eureka moments, he reminded the audience that true innovation rarely occurs in isolation. “Nearly all of these discoveries,” he said, “are built upon a single attribute: collaboration.”
A key theme of the presentation was the urgent need for global collaboration in the face of mounting geopolitical tensions and supply chain disruptions. Mitchell urged industry leaders to act decisively to mitigate fragmentation and enhance supply chain resilience. “We must act boldly to foster global collaboration to prevent fragmentation and inefficiencies and strengthen supply chains to reduce vulnerabilities,” he said.
The reality of competing interests often complicates partnership efforts, he said, citing the U.S.-China technology rivalry and the ongoing war in Ukraine as examples of challenges that continue to reshape global supply chains. The growing complexities of international trade, government regulations, and national security concerns make it increasingly difficult for companies to maintain a free flow of knowledge and resources.
Engaging the audience, Mitchell turned the floor over to attendees, encouraging a lively exchange of ideas. Participants voiced excitement about collaborative opportunities, particularly in Mexico, while raising concerns about economic slowdowns impacting the electronics sector. A recurring topic was the industry-wide skills gap: How can the next generation of engineers be inspired and trained to ensure continued progress? The discussion underscored the critical role of organizations like IPC in facilitating global industry dialogue and fostering innovation.
Despite the challenges ahead, Mitchell emphasized that collaboration is essential to sustaining innovation. “Breakthroughs continue, and the future remains within our reach,” he said, “underscoring the ongoing progress driven by collective effort.”
Suggested Items
I-Connect007’s Editor’s Choice: Five Must-Reads for the Week
07/04/2025 | Marcy LaRont, I-Connect007For our industry, we have seen several bullish market announcements over the past few weeks, including one this week by IDC on the massive growth in the global server market. We’re also closely watching global trade and nearshoring. One good example of successful nearshoring is Rehm Thermal Systems, which celebrates its 10th anniversary in Mexico and the official opening of its new building in Guadalajara.
China Plus One, Part 3: Inorsen Group, a Vietnam Success Story
07/03/2025 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.In recent years, Western OEMs have continued to push for China Plus One factories and the advancement of China’s Belt and Road Initiative (BRI). At present, there are two main modes for PCB companies to go global: building greenfield factories or through mergers and acquisitions (M&A). Thailand is currently the primary geographic choice to build greenfield factories, whereas, increasingly, mergers and acquisitions in Vietnam and Malaysia provide opportunities for companies to expand markets and acquire resources.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
The Global Electronics Association Launches Industry Leading Circularity Resource Hub, Fast-Tracking Cost-Reducing, Efficient Solutions for Manufacturers
07/01/2025 | Global Electronics AssociationToday, the Global Electronics Association – the voice of the electronics industry – launched its Circularity Resource Hub. The Hub provides a centralized home for the latest industry standards, best practices, and resources to accelerate electronics’ sustainable and circular evolution.
EU Defence Electronics Ecosystem Highlighted in Brussels
07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.