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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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Breaking Down Barriers: Key Insights from John Mitchell’s Keynote
March 24, 2025 | Brittany Martin, I-Connect007Estimated reading time: 1 minute
At the core of IPC President and CEO John Mitchell’s keynote at IPC APEX EXPO on March 19, 2025, was a compelling message: electronics drive innovation, but true progress is powered by collaboration. In delivering his keynote, Mitchell challenged industry leaders in attendance with a crucial question, “How can we strike a balance between the growing push for protectionism and the undeniable need for global cooperation?”
Mitchell illustrated how AI, clean energy, and space exploration are pushing the limits of innovation, with electronics serving as the backbone of global progress. While groundbreaking discoveries may appear to happen in sudden eureka moments, he reminded the audience that true innovation rarely occurs in isolation. “Nearly all of these discoveries,” he said, “are built upon a single attribute: collaboration.”
A key theme of the presentation was the urgent need for global collaboration in the face of mounting geopolitical tensions and supply chain disruptions. Mitchell urged industry leaders to act decisively to mitigate fragmentation and enhance supply chain resilience. “We must act boldly to foster global collaboration to prevent fragmentation and inefficiencies and strengthen supply chains to reduce vulnerabilities,” he said.
The reality of competing interests often complicates partnership efforts, he said, citing the U.S.-China technology rivalry and the ongoing war in Ukraine as examples of challenges that continue to reshape global supply chains. The growing complexities of international trade, government regulations, and national security concerns make it increasingly difficult for companies to maintain a free flow of knowledge and resources.
Engaging the audience, Mitchell turned the floor over to attendees, encouraging a lively exchange of ideas. Participants voiced excitement about collaborative opportunities, particularly in Mexico, while raising concerns about economic slowdowns impacting the electronics sector. A recurring topic was the industry-wide skills gap: How can the next generation of engineers be inspired and trained to ensure continued progress? The discussion underscored the critical role of organizations like IPC in facilitating global industry dialogue and fostering innovation.
Despite the challenges ahead, Mitchell emphasized that collaboration is essential to sustaining innovation. “Breakthroughs continue, and the future remains within our reach,” he said, “underscoring the ongoing progress driven by collective effort.”
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