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Real Time with... IPC APEX EXPO 2025: LPKF's Advancements in Laser Depaneling Technology
March 25, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
In this recent interview, Jake Benz from LPKF Laser and Electronics discusses advancements in laser depaneling technology, focusing on speed and quality. He highlights the previous negative reputation of laser depaneling and shares insights from nearly two decades of experience. As customer needs evolve, traditional companies are exploring laser technology. Benz emphasizes the importance of optimizing designs for laser cutting efficiency and the critical role of software in enhancing laser operations.
The 25th IPC APEX EXPO, which took place March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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Brent Fischthal - Koh YoungSuggested Items
Future-proof Laser Depaneling for PCBs with Photonics
04/10/2026 | Real Time with... APEX EXPOBill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.
Bold Laser Automation Introduces Precision Laser Cleaning System for Advanced Manufacturing
03/27/2026 | PRNewswireBold Laser Automation, Inc. has introduced the LPCl1820UV Laser Precision Cleaning System, a Class 1, industrial laser platform engineered for high-precision surface cleaning and thin-film removal in demanding manufacturing environments.
CEA-Leti, NcodiN Partner to Industrialize 300 mm Silicon Photonics
03/11/2026 | NcodiNCEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300 mm integrated photonics process.
Altus Supports Ei Electronics with LPKF Laser Depaneling Technology
03/09/2026 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics manufacturing industry, has supported Ei Electronics, Ireland’s largest manufacturer of home life-safety devices, with the installation of an LPKF CuttingMaster 2240 laser depaneling system to enhance PCB singulation and support growing production volumes.
Semtech Expands Data Center Portfolio with Acquisition of HieFo Corporation
03/05/2026 | SemtechSemtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.