Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Electroninks' MOD and iSAP Game Changers
March 25, 2025 | Marcy LaRont, PCB007 MagazineEstimated reading time: 1 minute
Electroninks, a prominent player in particle-free conductive inks, recently announced an exciting new range of metal-complex inks for ultra high density interconnect (UHDI) technology. At the SMTA UHDI Symposium in January, Mike Vinson, COO of Electroninks, gave a presentation on this line of MOD inks, which are versatile and suitable for a range of applications that require ultra-dense, miniaturized, and high-frequency technology. Mike says his technology is a game changer and will revolutionize UHDI circuit fabrication.
Marcy LaRont: Mike, would you give me a summary of your presentation at the SMTA UHDI symposium?
Mike Vinson: UHDI technology is crucial for developing smaller, more powerful electronic devices. However, its widespread adoption faces several challenges. Our line of products has been developed to address some of these key challenges. Our metal-complex inks simplify manufacturing while improving performance and reliability. We absolutely believe that these materials are poised to redefine how UHDI circuits are fabricated.
LaRont: Please explain what MOD stands for, how it works, and why this is a superior process.
Vinson: MOD is an acronym for metal-organic decomposition. MOD ink is particle-free, unlike the more standard nano-particle-based inks. Being particle-free gets you away from agglomeration, thus ensuring more uniform conductivity. From a processing standpoint, it is versatile for fabricators because multiple deposition methods can be used with it, including inkjet, screen printing, and spray coating. It has a very high peel strength and performs exceptionally well in extreme conditions and environments, and the process itself eliminates a lot of liquid waste. We call it eco-friendly manufacturing.
LaRont: Tell me about your proprietary iSAP process, another part of Electronink’s additive manufacturing solution.
Vinson: This ink-based semi-additive process (iSAP) is an innovative alternative to conventional subtractive etching and electroless plating. The main benefit of this process to fabricators is that, by leveraging MOD inks as a seed layer, iSAP offers a lower overall cost to manufacture. It eliminates process steps, while also significantly reducing waste and power usage compared to traditional etching. It also allows the fabricator to achieve those very fine lines and features required with UHDI, and improves signal integrity and RF performance in high frequency circuits. We believe that iSAP is a true game changer in the landscape of building UHDI circuits.
To read this entire conversation, which appeared in the March 2025 issue of PCB007 Magazine, click here.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
04/30/2026 | I-Connect007I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.
Sustainability Takes Center Stage in ‘On the Line With… Isola’ Podcast, Episode 3
03/25/2026 | I-Connect007I-Connect007 announces the release of Episode 3 of the podcast series On the Line With…, titled “The Green Circuit—Sustainability in PCB Manufacturing.” In this installment of PCB Materials: The Backbone and Future of Electronics, host Marcy LaRont speaks with Isola CTO Kirk Thompson about the growing role sustainability is playing in shaping the next generation of PCB materials and manufacturing processes.