Defense Speak Interpreted: Is There Still a CHIPS Act?
Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Koh Young Presenting on Real-Time Process Optimization at SEMI Heartland 2025
March 25, 2025 | Koh YoungEstimated reading time: 1 minute
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce that Luis Rivera, MES Team Leader at Koh Young America, will speak at SEMIEXPO Heartland 2025, taking place March 31 to April 2 in Indianapolis, Indiana at the Indiana Convention Center.
Rivera’s session, titled "Real-Time Process Optimization in the Smart Factory: Enabling Machine Connectivity for Data-Driven Insights," is scheduled for April 1 from 3:20 PM to 3:45 PM EDT on the SMART Manufacturing Stage. His presentation will explore how manufacturers can improve efficiency, productivity, and quality by integrating real-time data collection and analysis with machine connectivity.
Attendees will gain practical insights into how real-time process optimization enhances manufacturing performance by enabling seamless communication between inspection systems, production equipment, and data platforms. The session will highlight how leveraging this connectivity supports advanced analysis and actionable insights, enabling faster decision-making and adaptive process control.
In addition to connectivity and analytics, Rivera will underscore the pivotal role of metrology and inspection in modern electronics manufacturing. By capturing detailed 3D measurement data at critical points in the process, manufacturers can maximize yield and ensure the production of high-quality chips—a necessity in today's increasingly connected world.
“At Koh Young, we believe real-time data is the foundation for smart manufacturing,” said Rivera. “When machines speak the same language and communicate instantly, manufacturers can respond faster, improve process control, and ultimately deliver better outcomes in both quality and efficiency.”
Hosted by SEMI, SEMIEXPO Heartland brings together stakeholders from across the semiconductor ecosystem to discuss emerging trends, disruptive technologies, and strategies for scaling innovation. Koh Young’s participation reflects its commitment to advancing smart manufacturing through data-driven solutions and continuous innovation.
Share on:
Suggested Items
UHDI Fundamentals: UHDI Drives Unique IoT Innovation—Smart Homes
06/03/2025 | Anaya Vardya, American Standard CircuitsThe combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications.
Global Smart Manufacturing Market Size to Reach $787.54 Billion by 2030
06/02/2025 | PRNewswireThe global Smart Manufacturing Market Size is projected to be valued at USD 297.20 billion in 2023 and reach $787.54 billion by 2030, growing at a CAGR of 14.9% according to a new report by The Research Insights.
IBM Officially Closes Deal, Acquiring DataStax
05/30/2025 | I-Connect007On May 28, DataStax announced that its acquisition by IBM had officially closed. The open-source database company based in Santa Clarita, California, announced the deal earlier this year, as part of its vision to accelerate AI production and NoSQL data at scale.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
Driving Innovation: Traceability in PCB Production
05/29/2025 | Kurt Palmer -- Column: Driving InnovationTraceability across the entire printed circuit board production process is an increasingly important topic among established manufacturers and companies considering new PCB facilities. The reasons are apparent: Automatic loading of part programs, connection with MES systems and collection of production data, and compliance with Industry 4.0 requirements