The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
Indium to Showcase Innovative Materials Powering AI Technology at Productronica China
March 25, 2025 | Indium CorporationEstimated reading time: 1 minute
As a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that enabling AI advancements at Productronica China, March 26-28, in Shanghai, China.
Indium Corporation’s GalliTHERM® portfolio of gallium-based liquid metal solutions builds on more than 60 years of expertise in manufacturing advanced gallium-based materials. Designed for both TIM¹ and TIM² applications, these liquid metal TIMs offer cutting-edge thermal interface performance with superior reliability. Liquid metal TIMs offer:
- High thermal conductivity versus polymers
- High purity enables excellent wetting to surfaces
- No soldering or surface metallization needed
Indium Corporation’s Solder Thermal Interface Materials deliver superior heat dissipation and high thermal conductance for power-dense devices. Indium has a high bulk thermal conductivity (86 W/m-K) which means less sensitivity to bond line thicknesses and coplanarity issues compared to polymeric TIMs. Indium’s ductility can accommodate differential thermal expansion with minimal stress on the interface making Solder TIM an ideal TIM1 or TIM1.5 where die or substrate warpage and CTE mismatch challenges are present.
Indium Corporation’s Heat-Spring® solutions provide an optimal TIM2 solution as a compressible, non-reflow metal TIM. In liquid immersion systems, Heat-Spring® is also a proven TIM compatible with all major immersion fluids that will not dissolve in Single–Phase or Two-Phase immersion cooling liquids. These indium-based TIMs deliver outstanding thermal conductivity compared to non-metal alternatives—with pure indium metal achieving 86 W/m·K in all directions. Due to its solid metal state, Heat-Spring® effectively prevents pump-out and bake-out issues while also supporting sustainability through Indium Corporation’s reclaim and recycle program.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Peters Spotlights Heatsink Paste at productronica
10/22/2025 | PetersThe ELPEPCB HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025.
Indium Expert to Present on Advancing Thermal Performance at TestConX China
10/21/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).