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September 2025 PCB007 Magazine: The Future of Advanced Materials

09/16/2025 | I-Connect007 Editorial Team
Moore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.

Integrated Solutions for Board-level Reliability: A Smarter Path Forward

08/27/2025 | Alan Gardner, MacDermid Alpha Electronics Solutions
In today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.

Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress

08/04/2025 | Michael Carano -- Column: Trouble in Your Tank
Metallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.

Siemens Streamlines Design and Analysis of Complex, Heterogeneously Integrated 3D ICs

06/25/2025 | Siemens
Siemens Digital Industries Software introduced two new solutions to its Electronic Design Automation (EDA) portfolio that help semiconductor design teams address and overcome the complexity challenges associated with the design and manufacture of 2.5D and 3D Integrated Circuit (IC) designs.

Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI

03/12/2025 | Ventec International Group
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
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