Finding Strength Through Laughter: IPC Women in Electronics Reception Inspires and Engages
March 26, 2025 | Brittany Martin, I-Connect007Estimated reading time: 1 minute
The IPC APEX EXPO 2025 Women in Electronics Reception brought together women from the global electronics industry to network, enjoy refreshments, and engage in an insightful presentation by keynote speaker Jody Urquhart, a motivational speaker, comedienne, and author.
Urquhart opened her talk with humor, asking attendees how many needed a laugh versus those who needed therapy. This set the stage for a discussion on stress, resilience, and personal growth. She highlighted the impact of stress on performance, emphasizing that mistakes increase under pressure. To counter this, she encouraged attendees to embrace humor in their professional and personal lives.
A central theme of Urquhart’s talk was the challenge of belonging in male-dominated work environments. Rather than conforming to traditional notions of strength, she encouraged women to embrace their natural strengths—empathy, compassion, and emotional intelligence. These qualities, she noted, not only foster stronger connections but also enhance leadership effectiveness.
Urquhart also discussed the effects of constant ambition, warning that excessive focus on the future can prevent individuals from appreciating the present. She urged attendees to be mindful of their responses to stress, as external circumstances alone do not create anxiety—our reactions do. She emphasized the power of being fully present, both in work and relationships, and the importance of showing up authentically rather than attempting to control outcomes.
Another key point was the distinction between gratification and gratitude. In a fast-paced, digitally-driven world, the pursuit of success can lead to an insatiable desire for more. Urquhart advised the audience to be intentional about what they consume—both mentally and emotionally—since input directly influences well-being.
To conclude, Urquhart engaged attendees in interactive exercises, reinforcing the value of play and laughter as tools for reducing stress and enhancing engagement. Her message underscored the importance of presence, resilience, and embracing one’s unique strengths in both career and life.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronics SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
Siemens Streamlines Design and Analysis of Complex, Heterogeneously Integrated 3D ICs
06/25/2025 | SiemensSiemens Digital Industries Software introduced two new solutions to its Electronic Design Automation (EDA) portfolio that help semiconductor design teams address and overcome the complexity challenges associated with the design and manufacture of 2.5D and 3D Integrated Circuit (IC) designs.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.