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Fresh PCB Concepts: IPC-6012 Class 3 and High-reliability PCB Manufacturing

07/23/2026 | Team NCAB -- Column: Fresh PCB Concepts
IPC-6012 Class 3 is widely recognized as the benchmark for high-reliability manufacturing. Compared to Class 2, it establishes tighter requirements for plated holes, annular rings, copper wrap, conductor integrity, and inspection criteria. Those requirements reduce manufacturing defects and improve overall product quality. A common misconception is that a Class 3 PCB is inherently reliable. It isn't. IPC-6012 is fundamentally a workmanship and performance specification that defines manufacturing acceptability after the design is complete.

Micron and Ford Sign Strategic Agreement to Strengthen Long-Term Memory Supply and Industry Resilience

07/08/2026 | Micron
Micron Technology, Inc. and Ford Motor Company today announced a long-term Strategic Customer Agreement (SCA) to strengthen the supply of memory and storage solutions supporting Ford’s next-generation vehicle production.

How Faster Changeovers Unlock Production Capacity

07/08/2026 | Nolan Johnson, SMT007 Magazine
Traditionally, EMS companies have focused their continuous improvement efforts on machine speeds, placement accuracy, yield enhancement, and labor productivity. Yet across much of the industry, one of the largest contributors to lost capacity remains largely hidden in plain sight. We’re talking, of course, about setup time optimization. High-mix production is increasing even as product lifecycles shrink, meaning changeovers occur more frequently than ever, resulting in a proportionally larger amount of time lost to setup activities. Inefficient setup processes cost hundreds of hours of annual production capacity, and this lost time can mean the difference between a modest profit and self-funded company expansion.

Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

Quantum Systems Raises $1.2Bn Series D to Accelerate Growth and Scale Software-defined Autonomous Systems

07/03/2026 | Quantum Systems
Quantum Systems today announced the signing of its $1.2 billion Series D financing round, valuing the company at  ~ $8 billion on a post-money basis.
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