Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

ZenaTech Begins In-House PCB Flight Testing for NDAA-Compliant Blue UAS

08/12/2026 | BUSINESS WIRE
ZenaTech, Inc., announces that its U.S.-based subsidiary ZenaDrone has commenced flight testing of its custom-designed printed circuit boards (PCBs) at its UAE manufacturing and testing facility, integrating the proprietary boards directly into its ZenaDrone 1000 and IQ Nano drone platforms.

3 Key Takeaways: Design for Test Starts Long Before the First Test

08/05/2026 | I-Connect007 Editorial Team
Design for test has traditionally been viewed as the last checkpoint before a product enters production. Bert Horner's The Printed Circuit Assembler's Guide to... Design for Test challenges that thinking. In his book, he argues that testability should influence every stage of PCB and CCA development, from the first schematic through layout, manufacturing, inspection, and long-term product support. The result is a practical guide that connects engineering decisions with measurable manufacturing outcomes.

RTX's Raytheon Completes Installation of First SPY-6(V)4 Array at Wallops Island Test Site

08/03/2026 | Raytheon Company
Raytheon, an RTX business, has delivered and installed the first SPY-6(V)4 radar array at Surface Combat Systems Center at Wallops Island in Virginia, marking a major milestone for the U.S. Navy's Flight IIA Destroyer modernization effort and the SPY-6 backfit program.

Will Your Vias Survive the Heat? New Book From I-Connect007 Has the Answers

08/04/2026 | I-Connect007
I-Connect007 is excited to announce the release of The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, the newest title in its technical resources library. Written by reliability expert Bob Neves, the book examines one of the industry's most misunderstood topics: how to properly evaluate PCB via structures for assembly process survivability, long-term reliability, and robustness.

From Prototype to Product: Why E-Textile Standards Matter

07/22/2026 | Chris Jorgensen, Global Electronics Association
Imagine a neonatal monitoring wrap used in a hospital to track an infant’s vital signs during transport between units. It looks and feels like a soft textile. But embedded within it are conductive pathways, sensors, interconnections and electronics that must perform in a critical moment. If the product fails, the issue is not simply a garment defect or an electronics defect. It could affect clinical decision-making. That is what makes e-textiles so promising and so challenging.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in