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Building Value for Europe Through Smart Standards and More

10/06/2026 | Marcy LaRont, I-Connect007 Magazine
Europe’s electronics industry is navigating major shifts, from AI and automation to workforce challenges, sustainability, and evolving industrial policy. As the Global Electronics Association’s new vice president for Europe, Dominik Grau wants to understand what companies across the region need, and how the Association can help deliver it. In this interview, Dominik shares what he’s hearing directly from European electronics companies, why smart standards will become increasingly important in an AI-driven industry, and where he sees opportunities to bring together technology, workforce development, and the resources companies need to compete.

IPC Standards Support Professional Assessment for the Electronics Competition at WorldSkills Shanghai 2026

10/05/2026 | Global Electronics Association
The 48th WorldSkills Competition was held in Shanghai from September 22 to 27, concluding on September 27. According to the official competition results, Wu Tong of China won the gold medal in the Electronics competition, marking China’s fourth consecutive gold medal in this category.

SIA: Global Semiconductor Sales Top $1 Trillion Year-to-Date Through August

10/05/2026 | SIA
The Semiconductor Industry Association (SIA) announced global semiconductor sales were $159.7 billion during the month of August 2026, an increase of 8% compared to the July 2026 total of $147.9 billion and 144.3% more than the August 2025 total of $65.4 billion.

SelecTech Returns to SMTA International

10/05/2026 | SelecTech
StaticStop, a division of SelecTech, Inc. and a leader in the manufacture of innovative flooring products with long-term value and immediate benefits, will exhibit at the upcoming SMTA International, October 27-29, at Booth 2730.

Global Electronics Association and Fraunhofer Group for Microelectronics Sign MoU to Support Advanced Packaging Industrial Adoption

09/30/2026 | Global Electronics Association
The Global Electronics Association has signed a Memorandum of Understanding (MoU) with the Fraunhofer Group for Microelectronics to help accelerate the path from advanced packaging innovation to industry-scale manufacturing.