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CEE PCB Appoints Fred Hickman as Vice President of Sales, North America
April 3, 2025 | CEE PCBEstimated reading time: 1 minute

Tom Yang, CEO of CEE PCB, is pleased to announce the appointment of Fred E. Hickman III as Vice President of Sales for North America.
A seasoned industry leader with over 40 years of experience, Hickman has built a reputation for delivering exceptional customer experiences. His expertise spans technical sales, customer engagement, and strategic business development, making him a trusted partner for OEMs seeking cutting-edge PCB solutions.
"Fred brings the talent, experience, and reputation we need as we continue to expand our North American technology sales operations," said Tom Yang, CEO of CEE PCB. "His deep industry relationships and commitment to customer success align perfectly with our mission to be the most caring, helpful, and attentive PCB provider in the world. We are confident that Fred will play a key role in driving growth and strengthening our presence in North America."
Hickman expressed his enthusiasm for joining the company: "CEE PCB is exactly the kind of company I have been searching for at this stage of my career. I am highly selective about the PCB solutions I bring to my customers, and I am confident that CEE PCB can provide the comprehensive, high-quality solutions they need to succeed."
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
India: A Rising Exporter Still Dependent on Global Inputs
09/29/2025 | Global Electronics AssociationIndia has long been viewed as a country with vast potential in electronics manufacturing. Its large population, low labor costs, and growing domestic demand have made it an attractive destination for global companies looking to diversify production beyond China. In recent years, that potential has begun to materialize. Between 2017 and 2023, India emerged as one of the fastest-growing sources of finished electronics imports globally. This rapid expansion has been built on a foundation of imported components.
FTG Announces Acceptance by TSX of Normal Course Issuer Bid Renewal
09/29/2025 | Globe NewswireFiran Technology Group Corporation announced the acceptance by the Toronto Stock Exchange (TSX) of FTG’s Notice of Intention to Make a Normal Course Issuer Bid (NCIB), renewing the NCIB that expired in August 2025.
LPKF to Unveil CuttingMaster 2240 Cx at Productronica
09/26/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics SE will be showcasing the CuttingMaster 2240 Cx as part of the Fraunhofer IZM production line at this year's Productronica in Munich, demonstrating state-of-the-art laser technology in action.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/26/2025 | Marcy LaRont, I-Connect007Though the news cycle felt a little less exclamatory this week, there were many global business news headlines worth revisiting. Among them, China announced a bold carbon emissions goal of 10% over the next decade to double its solar and wind power capacity. The Wall Street Journal published an article, “Global Port Leaders See Trade Shifting, Not Slowing,” a nod to businesses’ risk mitigation strategies and execution around overreliance on China coming into play in a bigger way.
New Podcast Episode Drop: Optimize the Interconnect—It’s a Wrap!
09/29/2025 | I-Connect007The final episode of the On the Line With…Optimize the Interconnect podcast series ties together insights from across the program, underscoring the growing importance of unified solutions for high-volume HDI PCB manufacturing. Final guest Kuldip Johal, Chief Technology Officer and Vice President of Business Development, emphasized that manufacturers must balance yield, reliability, and scalability as interconnect density and complexity continue to increase.