The World's Smallest PPG Sensor Head
April 4, 2025 | BUSINESS WIREEstimated reading time: 1 minute

SCIVAX Corporation and TSLC Corporation, a SemiLEDs Corporation wholly owned company announced that SCIVAX+TSLC have developed the world's smallest PPG (PhotoPlethysmoGraphy)* sensor head, which will be presented at the display related technology exhibition ”Touch Taiwan” to be held in Taipei, Taiwan from April 16 to 18, 2025. The samples of the PPG sensor head for evaluation will begin in April 2025.
To date, SCIVAX and TSLC have developed the world's smallest light source device, Amtelus®, by combining our partner’s material technology with SCIVAX's optical lens design technology and TSLC’s advanced packaging technology and have begun shipping samples for evaluation. Utilizing the technology cultivated in SCIVAX’s nano-imprinted lens technology and TSLC’s advanced technology in making Amtelus®, we have succeeded in developing a new product in which the sensor head (signal acquisition part) of PPG sensors, which are used as vital sensors in smartwatches and other devices, is significantly smaller than conventional products.
This device has a mounting area of approximately 1 square millimeter, which is 1/10 of the conventional device, and the device thickness is about half that of conventional devices, achieving a significant reduction in size compared to conventional devices.
The main features of the PPG sensor head are as follows:
Minimum size
- By minimizing the mounting area of the PPG sensor head, it is possible to mount it in a narrow space, which was difficult to install in the past.
Expansion of applications through multiple deployments (arrays)
- By using multiple PPG sensor heads, more precise sensing can be achieved. In addition, by using the sensor head as an array, it is possible to measure blood flow even in a narrow space, so it can be used in beauty applications, home healthcare, and even nursing, for example.
Low cost
- Since it is a resin package in which the light source and optical sensor are integrally molded, it has a significant cost advantage compared to conventional products.
SCIVAX and TSLC are looking to expand into a variety of fields, including the application of this technology to next-generation life science fields such as vital sensors.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.