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Trouble in Your Tank: At 40 GHz, Everything Matters, Part 2

07/27/2026 | Michael Carano -- Column: Trouble in Your Tank
In Part 1 of this article, we examined alternative solderable finishes for 5G/6G applications and reviewed literature on their performance at high frequencies. We found that certain solderable finishes are more susceptible to signal loss as frequency increases. These attenuation losses become increasingly significant at frequencies approaching and exceeding 40 GHz. Because of their high conductivity, silver and copper generally outperform finishes such as nickel and palladium. Taken together, these findings underscore the importance of finish selection in high-frequency applications.

Trouble in Your Tank: At 40 GHz, Everything Matters, Part 1

07/07/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry supply chain is moving very quickly with the explosion of AI servers, high-performance computing, ADAS, quantum computing, and 5G/6G. Signal integrity is under scrutiny in an entirely new role. With many factors influencing signal integrity, one area that contributes to signal distortion at high frequencies is the PCB’s final finish layer deposits. Frequencies above 40 GHz are susceptible to such distortions, and data transfer rates of 224 GB/s are driving changes in PCBs and IC substrates.

Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish

05/07/2026 | Matt Stevenson -- Column: Connect the Dots
When designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.

Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities

11/26/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
Solderability testing answers a simple question: How readily will a termination form a sound solder joint under defined conditions? It is not component preconditioning. Rather, it evaluates wetting—the speed and extent to which molten solder spreads and adheres to a surface—using controlled methods (e.g., visual “dip-and-look” or wetting-balance measurements). Results reflect the combined effects of termination finish, storage and handling, flux activity, and the solder alloy in use.

Target Condition: Distribution of Power—Denounce the Ounce

11/05/2025 | Kelly Dack -- Column: Target Condition
Have you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
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