-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Cyient Announces the Launch of Semiconductor Subsidiary
April 8, 2025 | PRNewswireEstimated reading time: 1 minute
Cyient, a leading global engineering and technology solutions company, announced the launch of its fully owned semiconductor subsidiary, Cyient Semiconductors. This strategic move strengthens the company's commitment to innovation and excellence across the global semiconductor landscape.
By carrying forward Cyient's expertise in semiconductor design, Cyient Semiconductors will focus on scaling Application-Specific Integrated Circuit (ASIC) turnkey solutions for customers. For more than 25+ years, Cyient has been delivering comprehensive ASIC turnkey solutions and semiconductor design services across industrial, data center applications, automotive, and medical. Driven by strategic organic and inorganic growth, Cyient Semiconductors has built high-performance teams across India, the U.S., Germany, Belgium, the Netherlands, and Taiwan.
"Our vision is to align Cyient's semiconductor capabilities with the national agenda set by the Ministry of Electronics and Information Technology, aiming to build a robust semiconductor ecosystem in India. With the growing demand for high-performance semiconductor solutions, Cyient Semiconductors will play a crucial role in providing end-to-end ASIC turnkey and IC design services, supporting India's journey toward self-reliance in the semiconductor ecosystem," said Krishna Bodanapu, Executive Vice Chairman & Managing Director, Cyient.
"I am also happy to share that we have appointed Suman Narayan as the CEO of Cyient Semiconductors. Suman is an accomplished professional in the semiconductor space with a proven track record of managing large organizations, scaling semiconductor businesses, and driving digital transformation. His expertise in semiconductor products and ASIC development will be instrumental in shaping the future of Cyient Semiconductors," he added.
The semiconductor market is valued at approximately $600 billion and is projected to reach $2 trillion by 2032. The new subsidiary will tap into this high-growth opportunity, focusing on developing fabless semiconductor solutions while addressing the increasing demand for specialized semiconductor expertise.
"India is on the cusp of a semiconductor revolution, and Cyient is well-positioned to be at the forefront of this transformation," said Suman Narayan, CEO of Cyient Semiconductors.
"With our deep domain expertise, we will continue to empower global and domestic clients with high-value solutions. We firmly believe that the new semiconductor subsidiary will drive next-generation innovations meeting the requirements of our customers," he added.
Cyient's strong IP portfolio, deep domain expertise, long-standing customer partnerships, and global capabilities will give Cyient Semiconductors the strategic edge to achieve significant growth.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Infineon Technology Demonstrates Proven Reliability in Space on Artemis II Mission
04/21/2026 | InfineonNASA's Artemis II mission has successfully returned to Earth after ten days in space, having approached the Moon and reached the farthest distance from our planet ever achieved by crewed spaceflight.
Bosch Executive Erik Rein Elected New President of ESIA
04/21/2026 | ESIAOn 20 April 2026, the General Assembly of the European Semiconductor Industry Association (ESIA) gathered to elect Erik Rein, Executive Vice President and Board Member Mobility Electronics responsible for semiconductor business at Bosch, as the organisation’s new President.
SEMI Europe Policy Forum 2026 in Brussels to Focus on Chips Act 2.0
04/16/2026 | SEMIThe SEMI Europe Policy Forum Brussels 2026 to be held on June 3 will bring together industry leaders, economists, policymakers, and technology experts to examine how geopolitical dynamics are transforming the global semiconductor landscape and to identify concrete pathways for reinforcing Europe’s leadership role.
Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat
04/16/2026 | Alpha and Omega Semiconductor LimitedAlpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.
EdgeCortix Secures Investment from Axiro Semiconductor, MPower Partners for Edge AI
04/15/2026 | BUSINESS WIREEdgeCortix, a leading fabless semiconductor company specializing in energy-efficient AI processing at the edge, announced a new investment from Axiro Semiconductor Pvt. Ltd., a wholly owned subsidiary of CG Power and Industrial Solutions, and MPower Partners, a Japan-based global venture capital fund, building on the strong momentum of its previously oversubscribed funding round.