-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
DuPont Ikonic 9000 CMP Pads Win 2025 Edison Award
April 9, 2025 | DuPontEstimated reading time: 1 minute
DuPont announced that its Ikonic™ 9000 series of polishing pads for chemical mechanical planarization (CMP) was awarded a 2025 Bronze Edison Award™ in the AI-driven advancements category.
The Ikonic™ 9000 CMP pad series is a new expansion to DuPont’s Ikonic™ CMP product family, developed to enhance productivity and sustainability in semiconductor manufacturing processes for advanced chips. Ikonic™ 9000 pads have been recognized alongside other semiconductor innovations for AI and high-performance computing.
“Customers frequently turn to DuPont to tackle their next-generation technology challenges through advanced semiconductor materials,” said Sang Ho Kang, Vice President and General Manager, DuPont Semiconductor Technologies. “The development of Ikonic™ 9000 series pads is a successful outcome from addressing two critical needs for advanced node manufacturing—enhanced performance and more sustainable operations.”
Ikonic™ 9000 pads offer a high removal rate in CMP that leads to increased process throughput, and an advanced groove design aimed at maximizing slurry efficiency. At advanced fabrication nodes for chips supporting AI and high-performance computing, increased process complexity makes CMP efficiency especially important.
Additionally, the pads exhibit a longer operational life due to low wear rates, allowing for less frequent replacements and reduced downtime, optimizing production workflows. These features not only improve productivity, but also minimize waste, creating a more sustainable solution for semiconductor fabs.
“We are excited to see such a strong industry response to the launch of Ikonic™ 9000 pads, because they represent the start of a new wave of CMP innovation for performance, efficiency and sustainability,” said Randal King, Ph.D., Vice President of R&D/Technology, DuPont Electronics & Industrial. “DuPont is proud to be driving innovation across multiple new CMP pad and subpad families, and we look forward to launching more next-generation CMP pads to support advanced computing and AI.”
The Edison Awards™ is an annual competition honoring excellence in new product and service development, marketing, human-centered design, and innovation. Winners were selected from thousands of submissions and announced at the Edison Awards Gala in Fort Myers, Florida on Thursday, April 3, 2025.
Ikonic™ 9000 series CMP pads have been successfully placed at advanced technology nodes. Customers interested in learning more about Ikonic™ 9000 CMP pads or other opportunities to drive sustainability enhancements in their CMP processes should contact their DuPont account manager.
Suggested Items
Elma Electronic Bolsters Quality Management Company-wide with Added AS9100:D and ISO9001:2015 Certifications
06/02/2025 | Elma ElectronicElma Electronic now includes AS9100:D and ISO 9001:2015 certifications at its Horsham, Pa. manufacturing facility, earning the company a multiple site accreditation designation.
Maxar Space Systems Selected to Build High-Power EchoStar XXVI Satellite Share
06/02/2025 | BUSINESS WIREMaxar Space Systems, a trusted partner in satellite design and manufacturing, today announced it has been awarded a contract by EchoStar Corporation to manufacture EchoStar XXVI, a high-power geostationary communications satellite based on the Maxar 1300™ platform.
ispace Completes Success 8 of Mission 2 Milestones
06/02/2025 | ispaceispace, inc. (ispace) (TOKYO: 9348), a global lunar exploration company, announced that the RESILIENCE lunar lander has successfully completed all orbital maneuvers while in lunar orbit and is now being prepared for its landing attempt on June 6, 2025.
Strategic Materials Conference 2025 Spotlights Materials Innovation to Advance Semiconductor Manufacturing
06/02/2025 | SEMIWith materials innovation at the core of next-generation semiconductor technologies, the Strategic Materials Conference (SMC) 2025 brings together top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest trends and advancements.
IDC Increases its PC and Tablet Forecasts Despite Tariff Uncertainty
06/02/2025 | IDCAfter recording strong results in the first quarter of 2025, IDC is increasing its traditional PC forecast for 2025 — this comes despite the significant impact that US tariffs have had on its trading partners’ market sentiment.