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Real Time with... IPC APEX EXPO 2025: SPEA—Optimizing Testing Processes in PCBA
April 10, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Mike Sexton and Dustin Warren of SPEA explore market dynamics for PCBA manufacturers. They emphasize the need for optimizing testing processes, introducing deep In-Circuit Test (ICT) technology that identifies weak components often overlooked by traditional tests. The discussion also covers flying probe technology, highlighting its flexibility for high-mix, low-volume production and comparing it with ICT testing methods.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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