-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Saki’s AXI Upgrade Enhances Image Noise Reduction for Power Modules, Enabling Sharper, More Accurate Inspections
April 11, 2025 | Saki CorporationEstimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system. The latest software update introduces advanced functions that improve inspection accuracy for solder joint defect in complex power module assemblies. When combined with Saki’s existing shadow correction filter, which addresses challenges associated with heat dissipating pin-fin structures, the update further reinforces Saki’s capability in high-precision X-ray inspection for complex power modules, including those with thick, heat-dissipating finned baseplates.
In power modules, solder joint quality is critical to reliability. In particular, voids in the solder layer can significantly impact thermal and electrical performance, making high-resolution, high-sensitivity X-ray inspection essential for quality assurance in manufacturing lines.
Power modules, which manage high currents and voltages, typically incorporate complex thermal designs such as large power devices and finned heatsinks to ensure efficient heat dissipation. These architectures often result in significant height variations and intricate, multi-layered structures that include solder layers and heatsinks. Such complexity poses a challenge for conventional 2D X-ray imaging, which are unable to effectively detect defects within such structures with sufficient accuracy. Saki’s 3Xi-M200 AXI system overcomes these limitations with its unique planar CT technology, which separates individual layers to enable highly accurate void detection and defect analysis, even in densely structured assemblies.
The 3Xi-M200 system is equipped with a high-power X-ray source capable of penetrating thick baseplates. It has been widely recognized for its advanced noise filtering capabilities, which eliminate interference caused by heat-dissipating pin fins and enable high-resolution, high-contrast imaging. The latest software update further enhances performance by introducing the Brightness Offset Filter, which adjusts for brightness fluctuations resulting from structural height variations within a module. This advanced feature contributes to clearer, more stable imaging, particularly in complex modules, further supporting precise void detection and improving overall inspection accuracy.
Yoshihiro Akiyama, Director and Executive Fellow at Saki Corporation, commented: “As the power module market continues to expand, substrates with heat-dissipating pin fins are drawing renewed attention for their flexibility in balancing cost and performance. In response to evolving demands, especially in automotive applications, we have continued to refine our inspection technology. Since 2011, Saki has delivered specialized X-ray inspection solutions tailored to this sector and has earned strong recognition from leading power module manufacturers. Through our commitment to in-house hardware and software development, we remain focused on enhancing our inspection system capabilities to support quality assurance and performance in power electronics manufacturing.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
PARMI Enhances Support for Brazilian Electronics Manufacturers with New Local Partnership
08/26/2025 | PARMI USAPARMI USA, INC., a leader in advanced 3D inspection systems, is pleased to announce the appointment of Prosperar Solutions, led by Henrique Dantas, Commercial Director, as its new representative in Brazil.
Datest Unveils Viscom iX7059 XL 3D CT AXI System
08/25/2025 | DatestDatest, a trusted leader in advanced testing, engineering, inspection, and failure analysis services, and the go-to destination for when your boards misbehave and your AXI line goes on vacation, is thrilled to announce the arrival of its newest diagnostic weapon: the Viscom iX7059 XL 3D CT AXI Inspection System.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
TRI's Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025
08/11/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025.
TRI's Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025
08/08/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025.