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High Density Packaging User Group Announces ASKPCB Membership

11/03/2025 | HDP User Group
High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.

Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production

10/28/2025 | Kurt Palmer -- Column: Driving Innovation
Rigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.

MKS’ Atotech Showcases Next-gen PCB and Substrate Manufacturing Solutions at CPCA Plus 2025

10/24/2025 | MKS Inc.
MKS Inc., a global provider of enabling technologies that transform our world, announced its participation in CPCA Plus Show 2025, taking place October 28 – 30 at Shenzhen International Convention and Exhibition Center.

Altus Adds Breakthrough Automated Inline Laser Depaneling System to its Line-Up

10/21/2025 | Altus Group
Altus Group, a leading distributor of capital equipment in the UK and Ireland, is introducing the LPKF CuttingMaster 2240 Cx, an advanced automated laser depaneling system designed to be fully inline, to maximise efficiency and reduce costs in high-volume PCB production.

ASE, Analog Devices Announce Strategic Collaboration

10/21/2025 | BUSINESS WIRE
ASE Technology Holding Co., Ltd., and Analog Devices, Inc., announced strategic joint efforts in Penang, Malaysia with the signing of a binding Memorandum of Understanding.
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