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Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
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ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
April 16, 2025 | SEMIEstimated reading time: Less than a minute
The 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation. Hosted by SEMI, this premier technical conference will feature more than 25 hours of programming, including technical and poster sessions, keynote talks, a panel discussion, a tutorial, and networking opportunities. Registration is now open.
asmcASMC 2025 will feature over 120 speakers addressing critical topics such as yield enhancement and methodologies, advanced metrologies, advanced process control, and advanced equipment processes and materials. The conference is co-chaired by Katie Lutker-Lee, Process Engineer at TEL Technology Center America and Samira Bagheri, Operations Manager at EMD Electronics.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
10/13/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.
SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
10/09/2025 | SEMIGlobal 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.