Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
The Marketing Minute: Cracking the Code of Technical Marketing
YINCAE to Showcase Cutting-Edge Solutions at SEMICON Southeast Asia 2025
April 16, 2025 | YINCAEEstimated reading time: Less than a minute
YINCAE Advanced Materials, a leading provider of innovative solutions for the semiconductor and microelectronics industries, is proud to announce its participation in SEMICON Southeast Asia 2025. This premier event for the semiconductor and microelectronics sector will take place from May 20-22, 2025, at the Sands Expo and Convention Center in Singapore. YINCAE will be showcasing its latest advancements at booth #B2939.
Attendees are invited to visit YINCAE’s booth to explore the company’s cutting-edge innovations in board-level assembly materials, underfill, die attach adhesives, wafer-level materials, optoelectronic materials, and thermal interface materials. YINCAE’s team of experts will be available to discuss how its solutions address the evolving needs of the semiconductor and microelectronics market, with applications spanning automotive, military, aerospace, consumer electronics, telecommunications (e.g., 5G/6G), and AI.
“SEMICON Southeast Asia is a pivotal event for connecting with key stakeholders in the region’s semiconductor ecosystem,” said YINCAE’s CEO “We are excited to showcase our latest innovations and collaborate with customers to develop solutions that drive the semiconductor industry forward.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).