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Trio-Tech Wins $5.3M Order for AI GPU Boards

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Trio-Tech International, a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced it has received orders valued at approximately $5.3 million to supply high-performance Burn-In Boards (BIBs).

Koh Young to Present Data-Driven SMT Process Control for Manufacturing Resilience at EPP InnovationsFORUM+

03/17/2026 | Koh Young Technology
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will discuss how data-driven transparency supports manufacturing resilience in electronics manufacturing at the EPP InnovationsFORUM+ 2026, scheduled for April 15, 2026, at the Böblingen Congress Hall in, Germany.

Teradyne Introduces Omnyx: Redefining Board Test for the AI Era

03/17/2026 | BUSINESS WIRE
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced the launch of Omnyx, a groundbreaking manufacturing test platform for printed circuit board assemblies (PCBA) and sub-assemblies, engineered to meet the unique test requirements of AI and data centers.

From PEDC to APEX: Banyan.eco’s Disruptive AI for EMS and OEM Companies

03/17/2026 | Marcy LaRont, I-Connect007
The electronics industry’s struggle with supply chain resilience and increasing regulatory complexity has created a costly compliance challenge for OEMs and EMS providers alike. At the same time, advances in artificial intelligence are opening new possibilities for automating some of the industry’s most data-intensive tasks. At the Pan-European Design Conference (PEDC), Banyan.eco cofounder Francis D’Souza introduced a new approach that combines AI-driven data acquisition with a deterministic verification layer to eliminate compliance risk from AI hallucination and dramatically improve productivity.

Webinar Review, Part 1: A Packaging Revolution Powering the Next Era of AI Compute

03/15/2026 | Marcy LaRont, I-Connect007
The rapid rise of artificial intelligence has fundamentally reshaped the demands placed on semiconductor technology, and nowhere is it more evident than in advanced electronic packaging. A recent episode of the Global Electronics Association’s Executive Pulse webinar series, featuring Dr. Hemanth Dhavaleswarapu of AMD as the first of two esteemed presenters, provided a comprehensive overview of chip-level packaging. He outlined the evolution of AI workloads in forcing a rethinking of everything from chip architecture to data center design, with packaging now playing a central role in enabling continued performance scaling.
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