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Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
April 16, 2025 | KOKIEstimated reading time: Less than a minute
KOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Solder voiding is a persistent issue in electronic assembly, often impacting the reliability and performance of solder joints. While some degree of voiding is considered acceptable depending on the application, excessive voids can significantly compromise mechanical strength, electrical continuity, and thermal dissipation. In this webinar, McIntyre will explore the root causes of solder voiding and discuss key factors that influence void formation. Attendees will gain valuable insights into how material selection and process adjustments can help reduce voids and improve overall solder joint quality.
Designed for engineers, manufacturers, and industry professionals, this session offers practical strategies for optimizing soldering processes and ensuring greater product reliability.
Registration is now open.
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SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
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Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.