New High Power 3D AXI for Power Electronics from Test Research, Inc.

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Test Research, Inc. (TRI), a leading provider of Test and Inspection solutions for the electronics manufacturing industry, proudly announces the launch of the 3D AXI TR7600HP system. Designed for power semiconductor inspection, the TR7600HP enhances accuracy and efficiency in detecting defects in components such as IGBTs, MOSFETs, SiC inverters, and Paladin Connectors.

Equipped with High Power capabilities, the TR7600HP effectively avoids heatsink noise, ensuring clear and precise X-ray imaging. Built to meet the evolving demands of modern electronics manufacturing, the TR7600HP provides comprehensive internal inspection of semiconductors and power modules. The system efficiently analyzes multi-layer and specialized three-layer soldering, offering thorough defect detection for thick, multi-layered, and slim power modules.

The system can inspect large boards up to 850 mm x 520 mm and has high-resolution imaging, ranging from 7 to 30 µm, enabling reliable defect detection across industries, including aerospace and automotive. With a user-friendly interface, the TR7600HP simplifies setup and enhances operational efficiency. Inline fine-tuning capabilities allow manufacturers to fine-tune without interrupting production, optimizing workflow and reducing downtime. The system integrates with leading MES solutions, ensuring smooth data connectivity and process automation.

The TR7600HP integrates with Smart Factory production lines and MES, ensuring inspection traceability. The High Power AXI supports current Communication Standards, including SECS/GEM, SMEMA, IPC-CFX, IPC-DPMX, and the Hermes Standard (IPC-HERMES-9852).