Spirit Electronics Expands U.S. Semiconductor Capacity with Acquisition of SMART Microsystems
April 17, 2025 | BUSINESS WIREEstimated reading time: 1 minute
As part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio. This expansion into Northeast Ohio marks a significant step in fostering academic and industry collaboration to accelerate innovation and workforce development in the U.S. semiconductor sector.
“This acquisition supports our mission to expand U.S. semiconductor capacity with secure, high-reliability solutions,” said Marti McCurdy, CEO of Spirit Electronics. “Partnering with LCCC allows us to invest directly in the future talent pipeline and emerging technologies that are critical to national security and domestic innovation.”
Located within the LCCC campus, SMART Microsystems will serve as a hub for advanced research and education in materials, MEMS, and advanced packaging technologies, including 2.5D and 3D integration.
“We are proud to collaborate with Spirit Electronics to bring new opportunities to Northeast Ohio,” said Dr. Marcia Ballinger, President of Lorain County Community College. “This partnership enhances our ability to prepare students for high-tech careers while contributing to the growth of a robust semiconductor ecosystem in our region and beyond.”
Together, Spirit Electronics and LCCC are laying the foundation for a resilient, innovation-driven semiconductor future.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Entegris Announces Plans for $700 Million Investment in the United States, Technology Center in Illinois
08/22/2025 | BUSINESS WIREEntegris, Inc., a global leader in advanced materials science, in collaboration with the Trump Administration, announced $700 million in domestic R&D spending over the next several years to accelerate semiconductor innovation.
izmomicro Achieves Breakthrough in Silicon Photonics Packaging, Establishing India's Leadership in Advanced Semiconductor Integration
08/21/2025 | PRNewswireizmomicro, a specialized division of izmo Ltd., announced a major milestone in silicon photonics packaging, underscoring its role as a pioneer in India's semiconductor ecosystem and advancing the country's position in the global race toward next-generation data and AI infrastructure.
Indium Corporation to Showcase Innovative Materials Enabling AI Technology at SEMICON Taiwan
08/20/2025 | Indium CorporationIndium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, AI, thin-film, and thermal management markets, will showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs) at SEMICON Taiwan, to be held September 10-12 in Taipei, Taiwan.
TRI: Discover SEMI Inspection and Metrology at SEMICON India 2025
08/20/2025 | TRITest & Research India PVT, LTD. (T&R India), TRI's distributor, will join SEMICON India 2025 at Yashobhoomi (IICC), New Delhi, India from September 2 – 4, 2025.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/20/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.