Defense Speak Interpreted: Is There Still a CHIPS Act?
Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Spirit Electronics Expands U.S. Semiconductor Capacity with Acquisition of SMART Microsystems
April 17, 2025 | BUSINESS WIREEstimated reading time: 1 minute
As part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio. This expansion into Northeast Ohio marks a significant step in fostering academic and industry collaboration to accelerate innovation and workforce development in the U.S. semiconductor sector.
“This acquisition supports our mission to expand U.S. semiconductor capacity with secure, high-reliability solutions,” said Marti McCurdy, CEO of Spirit Electronics. “Partnering with LCCC allows us to invest directly in the future talent pipeline and emerging technologies that are critical to national security and domestic innovation.”
Located within the LCCC campus, SMART Microsystems will serve as a hub for advanced research and education in materials, MEMS, and advanced packaging technologies, including 2.5D and 3D integration.
“We are proud to collaborate with Spirit Electronics to bring new opportunities to Northeast Ohio,” said Dr. Marcia Ballinger, President of Lorain County Community College. “This partnership enhances our ability to prepare students for high-tech careers while contributing to the growth of a robust semiconductor ecosystem in our region and beyond.”
Together, Spirit Electronics and LCCC are laying the foundation for a resilient, innovation-driven semiconductor future.
Share on:
Suggested Items
SEMI Announces Election of Tien Wu, ASE CEO, as International Board Chair
06/12/2025 | SEMISEMI, the industry association representing the global electronics design and manufacturing supply chain, today announced that its International Board of Directors has elected Dr. Tien Wu, CEO of Advanced Semiconductor Engineering, Inc. (ASE), as its new chair, and Benjamin Loh, Chair of Comet AG, as its new vice chair, effective immediately, in accordance with the association's by-laws.
StratEdge Marks 40 Years of Innovation at IMS 2025 Booth 336
06/12/2025 | StratEdgeStratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, will showcase its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 336.
Micron, Trump Administration Announce Expanded U.S. Investments in Leading-Edge DRAM Manufacturing and R&D
06/12/2025 | MicronMicron Technology, Inc. and the Trump Administration today announced Micron’s plans to expand its U.S. investments to approximately $150 billion in domestic memory manufacturing and $50 billion in R&D, creating an estimated 90,000 direct and indirect jobs.
'TSMC-UTokyo Lab' Launched to Promote Advanced Semiconductor Research, Education and Talent Incubation
06/12/2025 | TSMCThe University of Tokyo (UTokyo) and TSMC announced the opening of the “TSMC-UTokyo Lab”, dedicated to advancing semiconductor research, education and talent incubation.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd