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The upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
In a featured article, “Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction,” Kuldip Johal of MKS’ Atotech explores one of the most critical reliability points in next-generation designs. As requirements for higher bandwidth, lower latency, and increased compute density accelerate, advanced packaging technologies are evolving rapidly. This piece examines how innovations at the microvia level are influencing performance and long-term reliability, underscoring the foundational role of interconnect integrity in AI-driven systems.
Another feature, “Single Pair Ethernet (SPE): A Valuable Option for Modern Designs,” highlights a promising solution for reducing system complexity and cost. In this interview, Simon Seereiner of Weidmuller and Thomas Keller of Rosenberger discuss the growing adoption of SPE as a streamlined, high-performance networking approach. As electronics systems become more compact and interconnected, SPE offers a scalable Ethernet pathway designed to meet the demands of modern industrial and embedded applications.
Expanding the discussion further, “Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging,” by Marcy LaRont, draws from the Global Electronics Association’s Executive Pulse webinar series. Building on earlier discussions of chip-level innovation, this installment shifts to a systems-level perspective. Featuring insights from Dr. Jung Yoon of IBM, the article explores how AI is reshaping infrastructure, from advanced packaging strategies to data center design and global supply chain considerations, highlighting the interconnected nature of today’s electronics ecosystem.
Don’t miss the upcoming issue of Advanced Electronics Packaging Digest for timely insight into the most current technologies and trends shaping the future of electronic systems. Subscribe here to get the next issue delivered to your inbox on April 20, 2026. Find us on Substack for another way to read.
