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ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
April 18, 2025 | ViTrox TechnologiesEstimated reading time: 2 minutes
ViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC). As a globally recognised intelligent vision inspection solutions provider, ViTrox will showcase its state-of-the-art SMT PCB vision inspection solutions and Integrated Industrial Embedded Solutions, reaffirming its commitment to driving innovation in the semiconductor and electronics manufacturing industries.
As one of the industry’s most influential B2B exhibitions, NEPCON China gathers leading suppliers from across the electronics, semiconductor, automotive, and new energy sectors. This year’s event also provides an excellent opportunity for ViTrox to celebrate 25 years of innovation and excellence with its valued partners and customers.
Experience ViTrox's Advanced Solutions at Nepcon China 2025:
Revolutionary V310i Advanced 3D Solder Paste Inspection (SPI)
The V310i SPI system is engineered to deliver precise and consistent solder paste inspection, catering to both novice and experienced users. It offers outstanding defect detection capabilities, user-friendly and simplified programming, and exceptional inspection accuracy. Compliant with IPC-CFX-2591 standards, it supports advanced data correlation and closed-loop capabilities to optimise solder paste inspection, ultimately bolstering production efficiency with reliable and optimal solder paste inspection.
Award-Winning V510i Advanced DST 3D Optical Inspection (AOI) DST!
The award-winning V510i DST AOI platform is engineered with a dual-sided inspection system, enabling simultaneous 2D/3D top and bottom assembly inspection processes for the PCB assembly, especially to support THT and standard SMT components. Its unique top and bottom vision module, combined with the 100mm tall component inspection capability and AI Smart programming, sets a new level for back-end manufacturing processes, redefining inspection capabilities.
V810i S2EX Advanced 3D X-ray Inspection System (AXI) – Award-Winning!
Designed for the PCB manufacturing process, the award-winning V810i S2EX supports large board sizes up to 609.6mm x 482.6mm (24" x 19"). The system offers the dual-lane solution, enabling high-speed and high-throughput 3D AXI solution. With the high-resolution X-ray imaging and AI features, AXI ensures comprehensive defect detection with exceptional accuracy.
V9i Advanced Robotic Vision (ARV) – Award-Winning!
The V9i ARV system automates conformal coating and final assembly inspections with 6-axis COBOT technology, CAD-less Smart Learning, and multi-focal vision. Its outstanding flexibility and precision have earned the V9i Solution multiple industry awards, making it a powerful alternative to traditional manual inspection.
VisionXpert Smart Code Reader (XS Series)
The XS-Series Smart Code Reader enhances traceability and productivity with advanced decoding technology, AI auto-tuning, and deep learning capabilities. Designed for seamless integration and cost-efficiency, it is ideal for highly dynamic production environments.
VisionXpert Smart Camera (XC-Series) – NPI!
The XC-Series Smart Camera is a compact yet powerful “mini AOI” solution. With AI auto-tuning, deep learning capabilities, and advanced vision tools, it delivers highly accurate inspections. Its small footprint enables seamless integration into a space-limited environment, offering cost-effective automation solutions.
V-ONE Industry 4.0 Manufacturing Intelligence Solutions
V-ONE is a smart manufacturing platform that optimises production with real-time data visualisation, AI-driven insights, and full traceability. It features customisable dashboards, cross-referenced inspection data, and seamless SMT PCBA integration, driving enhanced efficiency and intelligent decision-making.
ViTrox is excited to connect with industry leaders at NEPCON China 2025. Visit our booth for live demonstrations, expert consultations, and in-depth discussions on how our advanced solutions can elevate your manufacturing processes.
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Rachael Temple - AlltematedSuggested Items
Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
10/30/2025 | Real Time with...SMTAIJoel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.
New Episode of Voices of the Industry Podcast Explores Breakthroughs in Test and Inspection
10/22/2025 | I-Connect007In this episode of Voices of the Industry, “Testing Innovation: Advances in Test, Inspection & Failure Analysis,” host Nolan Johnson speaks with Rob Boguski, president of Datest. Together, they explore the expanding world of circuit testing, inspection, and failure analysis, areas that are experiencing a surge in technological capability and sophistication. As Johnson and Boguski discuss, today’s test companies are performing analyses and precision methods that would have seemed impossible just a decade ago.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana
10/14/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech Forum on November 13, 2025, at the Quartz Hotel in Tijuana, Baja California.