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Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

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The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

Remtec Announces the Industry's Most Complete Suite of Plating Capabilities Including PCTF Technology for Advanced Electronic Packaging

07/07/2026 | Remtec
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Below the Surface: From Nanometers to 10-Gauge—It’s More Than Just a Wire

06/22/2026 | Chandra Gupta -- Column: Below the Surface
Modern life runs on wires: your cell phone, your car, the satellites orbiting above us, and even the dryer in your laundry room all depend on the simple idea of moving electricity from one place to another. From nanometer-scale traces etched onto a semiconductor chip to a thick 10-gauge copper wire carrying current to heat your clothes, it’s tempting to say, “It’s just a wire.” But that hides the real story. The magic isn’t the wire itself, but in the materials that insulate, protect, support, and connect it, often under extreme conditions of heat, voltage, vibration, and time.

Square Peg Communications and VIAVI Solutions Join Forces to Advance 5G NTN Testing

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Square Peg Communications, the company that enables the emulation and testing of complex satellite and hybrid networks, announced a strategic partnership with VIAVI Solutions to deliver advanced test capabilities for the rapidly emerging 5G NTN market.

Keysight, NTT DOCOMO, and NTT Collaborate on 6G Wireless Channel Modeling

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