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NVIDIA Seeks to Raise HBM4 Specs in Response to AMD Competition; SK hynix Expected to Remain Largest Supplier in 2026

09/18/2025 | TrendForce
TrendForce reports that NVIDIA has recently pressed key component suppliers of its Vera Rubin server racks to upgrade product specifications, specifically requesting that HBM4 speed per pin be raised to 10 Gbps, as AMD gets set to launch its MI450 Helios platform in 2026.

Micron Ships HBM4 to Key Customers to Power Next-Gen AI Platforms

06/11/2025 | Micron
The importance of high-performance memory has never been greater, fueled by its crucial role in supporting the growing demands of AI training and inference workloads in data centers. Micron Technology, Inc.,  announced the shipment of HBM4 36GB 12-high samples to multiple key customers.

HBM4 Raises the Bar on Manufacturing Complexity, Premium Expected to Exceed 30%

05/22/2025 | TrendForce
TrendForce's latest findings reveal that demand for AI servers continues to accelerate the development of HBM technologies, with the three major suppliers actively advancing their HBM4 product roadmaps.

SK hynix Leads the Market with HBM3e 16hi Products, Boosting Capacity Limits

11/14/2024 | TrendForce
SK hynix recently unveiled its development of HBM3e 16hi memory at the SK AI Summit 2024, featuring a 48 GB capacity per cube, with sampling scheduled for the first half of 2025.

JEDEC Approaches Finalization of HBM4 Standard, Eyes Future Innovations

07/15/2024 | JEDEC
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, announced it is nearing completion of the next version of its highly anticipated High Bandwidth Memory (HBM) DRAM standard: HBM4. 
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