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GlobalFoundries Accelerates GHG Reductions Commitments with Near Term Science-Based Target
April 23, 2025 | GlobalFoundriesEstimated reading time: 1 minute
GlobalFoundries announced it will accelerate its near-term greenhouse gas (GHG) emission reduction goals, enhancing the company’s commitment to sustainable operations and further supporting the sustainability leadership of partners including Apple and Infineon Technologies AG. GF’s revised targets will be set in line with Science Based Target Initiative (SBTi) standards.
GF is updating its Journey to Zero Carbon pledge with the accelerated commitment to reduce total GHG emissions by 42% from 2021 to 2030, up from the previous target of 25%, even as the company continues to expand its global semiconductor manufacturing capacity. GF is on track to meet this more ambitious 42% reduction goal, which will be accomplished through a comprehensive mix of energy efficiency improvements, state-of-the-art emissions controls, expanded use of alternative chemistries, and use of lower-carbon power across its fabs in the U.S., Germany and Singapore.
As part of this pledge, GF has committed to set its GHG emission reduction target in alignment with SBTi, widely considered the gold standard for science-based carbon reduction targets.
“Addressing today’s sustainability challenges is no small task, and GF has a strong track record of advancing responsible manufacturing and helping our customers achieve their sustainability goals,” said Niels Anderskouv, chief business officer and incoming president and chief operating officer at GF. “The essential chips we manufacture are in countless technologies and devices around the world. Our commitment to SBTi, and its vigilant framework for meaningful greenhouse gas emissions reductions, is both the right thing to do and another way for GF to be an environmentally responsible partner to our customers and communities.”
In partnering with Apple, GF is enhancing the sustainability of its semiconductor manufacturing operations and further reducing fluorinated GHG emissions, which have global warming potential thousands of times greater than that of CO2. GF has also been partnering with Infineon to set and meet more ambitious GHG reduction targets, in alignment with Infineon’s SBTi plans to address climate change across its entire value chain.
As GF works with SBTi on its near-term GHG emission reduction target, the company remains committed to its previously stated goals of achieving net-zero GHG emissions and 100% carbon-neutral power by 2050. Net-zero is a widely recognized global objective aimed at reducing emissions and supporting long-term environmental sustainability.
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Green Circuits Appoints Kaitlyn Muhlenforth as Marketing Manager
11/05/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is excited to announce the appointment of Kaitlyn Muhlenforth as its new Marketing Manager.
On the Line With… Ultra HDI, Episode 8: “Materials, Up and Coming Capabilities,” Now Available
11/05/2025 | I-Connect007I-Connect007 is excited to announce the release of the eighth episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Materials, Up and Coming Capabilities,” host Nolan Johnson sits down with resident expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to discuss how material selection influences the Ultra HDI (UHDI) manufacturing process.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.