Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability
April 24, 2025 | LITEON TechnologyEstimated reading time: 1 minute
LITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Building upon their initial collaboration in 2023, which focused on developing low-carbon Flexible Printed Circuits (FPC) technology for commercial applications, this new agreement expands the scope to include equipment investment with integration into existing production lines in cooperative factories. The adoption of Elephantech’s proprietary technology will help inject new momentum into building a more sustainable supply chain.
Roger Chen, Director of LITEON+, the company's startup platform, stated: "The signing of our second MoU marks a new milestone in our partnership with Elephantech. We're moving beyond early-stage product applications in equipment investment. Through this advancement, we will be able to embed sustainability deeper into our operations and continue leading the industry in building sustainable competitiveness."
Since its establishment in 2023, LITEON+ has been dedicated to nurturing promising global startups that share a vision for sustainability. The platform provides resources, technology and accesses to international market expansion. Elephantech, as one of LITEON+'s first strategic partners, has been instrumental in developing innovative applications for low-carbon PCB technology.
Elephantech's agile startup model has rapidly accelerated new technology implementation. In just six months, both companies have successfully validated the feasibility of applying Elephantech’s technology to multilayer PCBs. Under this new MoU, LITEON plans to invest in Elephantech's proprietary PCB manufacturing equipment and implement it into existing cooperative factories to comprehensively upgrade production lines. This collaboration will help to reduce the carbon footprint of consumer electronics production, cut water and copper consumption, minimize environmental impact—ultimately enhancing sustainability throughout the supply chain and setting a new benchmark for green manufacturing.
Share on:
Suggested Items
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.