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Summit Interconnect Hollister Elevates PCB Prototyping with New TiTAN Direct Imaging System from Technica USA
May 1, 2025 | Summit Interconnect, Inc.Estimated reading time: 1 minute

Summit Interconnect’s Hollister facility has recently enhanced its quick-turn PCB prototyping capabilities by installing the TiTAN PSR-H Direct Imaging (DI) system. This advanced equipment, developed by CBT and supplied by Technica USA, is renowned for its high-speed, high-resolution imaging capabilities, particularly for photoimageable solder masks.
The TiTAN PSR-H model offers several key features:
- High-Speed Imaging: Recognized as the fastest in its class for all photoimageable solder masks, including standard, black, and white variants.
- Versatility: Capable of handling both dry film and solder mask printing with exceptional front-to-back registration accuracy.
- Precision: Delivers print resolutions down to 10 microns, powered by CBT’s patented technology.
This installation aligns with Summit Interconnect’s commitment to integrating cutting-edge technology across its facilities to meet the evolving demands of the PCB industry. The Hollister site, known for specializing in 24-hour quick-turn PCB prototyping, will benefit from the TiTAN system’s capabilities, ensuring faster turnaround times and enhanced quality for complex PCB designs.
By investing in such advanced imaging technology, Summit Interconnect reinforces its position as a leading provider of high-reliability, advanced technology printed circuit boards in North America. This move not only boosts the Hollister facility’s operational efficiency but also enhances its ability to serve industries requiring rapid prototyping and precision manufacturing.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.