Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
It's Only Common Sense: The Evolution of Prospecting
Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
Wolfspeed Announces Executive Leadership Change
May 2, 2025 | WolfspeedEstimated reading time: Less than a minute
Wolfspeed, Inc. announced that it has mutually agreed with Neill Reynolds to conclude his role as Executive Vice President and Chief Financial Officer, effective May 30, 2025, to pursue another professional opportunity.
Reynolds will remain with the Company to ensure an orderly transition as it continues its active discussions with its lenders in an effort to strengthen the Company’s capital structure. Reynolds will also participate in the Company’s fiscal third quarter earnings call, scheduled for May 8.
“Neill has been an important partner as we navigate our liability-management initiatives and position Wolfspeed for its next phase,” said Thomas Werner, Executive Chairman. “We appreciate his commitment to staying on to support our efforts to strengthen the Company’s balance sheet. On behalf of the entire Board and management team, we’d like to thank him for his contributions to the Company and wish him success in his new endeavor.”
The Company has initiated a search with a leading executive-search firm to evaluate internal and external candidates for a permanent Chief Financial Officer.
Lastly, the Company reaffirms its previously announced financial guidance for the third quarter of fiscal 2025.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.
Machvision Leads Shift to Automated Inline Final Inspection, AOI in North America
09/10/2025 | Ralph Jacobo, all4-PCBSchweitzer Engineering Laboratories (SEL) chose Machvision inspection equipment due to its capabilities and versatility. Machvision of Taiwan offers circuit inspection, hole inspection and measurement, IC Substrate and HDI inspection, and final visual inspection solutions. The best fit for SEL was the 4.0Pro Circuit Inspection for inner and outer layers, and the AFI6 for final visual inspection of finished panels.
KYZEN to Highlight High-Reliability MICRONOX Chemistries at SEMICON West 2025
09/08/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation in SEMICON West 2025, taking place October 7–9 at the Phoenix Convention Center in Phoenix, Arizona.