SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit

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SEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.

Europe’s premier event connecting the entire electronics design and manufacturing supply chain, SEMICON Europa 2025 will gather industry experts and innovators to explore how international collaboration is driving technological innovation, economic resilience, and sustainability across Europe’s semiconductor ecosystem. The exhibition and conference will be co-located with productronica. 

Call for Abstracts

Advanced Packaging Conference (APC) ─ Key Enabler for System Performance

Advanced packaging technologies—including 2.5D and 3D stacking, chiplet integration, and heterogeneous packaging—are revolutionizing system performance by delivering greater processing power and energy efficiency. Innovations in advanced materials and interconnects are further reducing signal loss and latency, enabling high-performance computing and AI at scale. Abstracts are invited on key topics including advanced materials and processes for packaging, power and thermal management in 2.5D/3D packaging, packaging innovations for silicon photonics, and testing inspection and metrology.

MEMS & Imaging Sensors Summit ─ Industry Meets Innovative Ideas

Entrepreneurs, startups, graduates, and newcomers will showcase their research and early-stage products. Topics of interest include new applications and use cases for MEMS and sensors, advancements in technology and materials, smart MEMS and AI integration, MEMS-photonics co-integration, alternative imaging sensor architectures, and foundry offers for start-ups.

Pre-recorded Innovation Presentations ─ Global Collaborations for European Economic Resilience

SEMI Europe will also highlight microelectronics and semiconductors innovations in short pre-recorded messages, pitches and product announcements that will be aired on SEMICON Europa 2025 main stages during networking sessions and on the final day of the exhibition. Projects of interest include sustainability and green technologies, diversity and inclusion, semiconductor advancements in aerospace, defense and automotive applications, as well as smart manufacturing, cybersecurity and more.

Presentation abstracts, biographies, and headshots must be submitted in English through the SEMICON Europa 2025 Call for Abstracts portal by Friday, June 20, 2025. Selected presenters will be notified in August 2025.