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ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing

05/26/2025 | ClassOne Technology
ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging.

Pioneering Energy-Efficient AI with Innovative Ferroelectric Technology

05/22/2025 | Fraunhofer
As artificial intelligence (AI) becomes increasingly integrated into sectors such as healthcare, autonomous vehicles and smart cities, traditional computing architectures face significant limitations in processing speed and energy efficiency

Pluritec: Growth Depends on Developing Next-gen Products

05/15/2025 | Marcy LaRont, PCB007 Magazine
Maurizio Bonati, VP of sales at Pluritec, says a new generation of products has driven strong business performance and a significant backlog. However, there’s a concern about the potential negative impact of tariffs. Pluritec is taking proactive measures to minimize these effects by focusing on enhancing equipment capabilities, automating processes, and expanding customer support.

Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity

05/14/2025 | BUSINESS WIRE
Corning Incorporated, a world leader in glass science and optical physics, today announced a collaboration with Broadcom Incorporated, a leading supplier in the semiconductor field, on a co-packaged optics (CPO) infrastructure that will significantly increase processing capacity within data centers.

NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving

05/09/2025 | NXP Semiconductor
NXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
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