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Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications
May 5, 2025 | Elma ElectronicEstimated reading time: 1 minute
Elma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot version. Equipped with six 3U payload slots and one VITA 62 power supply slot, the new 3U VPX/OpenVPX test and development platform allows for SBC and GPU coupling and distribution directly through the backplane.
The CompacFrame was designed to meet the complex needs of AI-based processing when testing and developing rugged embedded applications. Typical applications include where one GPU/SBC pair is running an inference model and another is supporting signal processing of RF data or driving a high-definition display.
The portable unit is ideal for compute-intensive processing of electro-optical/infrared (EO/IR) and radio frequency (RF) using AI, machine learning (ML) or traditional digital signal processing (DSP) algorithms. Applications include radar beamforming, synthetic aperture radar (SAR), ground moving target indicator (GMTI) radar, autonomous navigation, threat detection and identification as well as target tracking and display, sensor fusion, surveillance and situational awareness.
Because the slot profiles are aligned with SOSA and CMOSS, the AI optimized CompacFrame is ideal for modern military applications that will adhere to the Modular Open Systems Approach (MOSA), an interoperability initiative driven by the Department of Defense. A fully SOSA aligned VITA 46.11 chassis manager is accessible from a connector on the rear of the unit.
For maximum throughput and speed, the 6+1 backplane (six VITA 65 payload slots, one VITA 62 power supply slot) supports a dual domain Ethernet switch up to 100GBASE-KR4 and the expansion plane link supports PCI Express (PCIe) Gen4. With 16 lanes of PCIe between a host SBC and a GPU, including meshed GPUs between slots 5 and 6, the backplane can handle multiple AI-based use cases.
Designed for flexible test and development, the new CompacFrame provides several easy-to-use features. Both air-cooled and conduction-cooled payload boards can be inserted. The angled card cage provides easy access to plug-in cards and the front panel includes reset and power switches as well as voltage-monitoring LEDs and test points. The rear of the unit contains an Ethernet port, serial port - chassis manager, USB port aggregator and LED indicators for power, fan, and over temp.
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Rachael Temple - AlltematedSuggested Items
Henger Targets AI PCB Challenges With Advanced Plasma Technology
04/02/2026 | I-Connect007 Editorial TeamHenger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.
Leonardo DRS Introduces THOR, Delivering Decisive Edge Computing Power to the Modern Battlefield
03/25/2026 | BUSINESS WIRELeonardo DRS, Inc. announced the introduction of THOR - Tactical, High-Performance Embedded Computing, Open Architecture, Rugged - a rugged, open-architecture 3U VPX embedded computing chassis purpose-built to deliver high-performance processing at the tactical edge.
Texas Instruments Expands Microcontroller Portfolio to Enable Edge AI in Every Device
03/13/2026 | Texas InstrumentsTexas Instruments (TI) introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate
Chemcut at APEX EXPO 2026: Innovations & Opportunities
03/11/2026 | Chemcut CorporationNext week, Chemcut will be exhibiting at APEX EXPO, taking place March 17–19, 2026 at the Anaheim Convention Center in Anaheim, California.
Kurtz Ersa Goes Semiconductor: Expanding Competence in Microelectronics & Advanced Packaging
03/06/2026 | Kurtz Ersa Corp.Kurtz Ersa Inc. is strengthening its position in microelectronics and semiconductor technology. Effective September 1, 2025, ATV Technologie GmbH officially became part of the Kurtz Ersa Group and will operate under the new name Kurtz Ersa Semicon GmbH.