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StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA
May 7, 2025 | StratEdgeEstimated reading time: 1 minute
StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech, taking place May 19–21 at the Hilton New Orleans Riverside, and in Booth 723 at Space Tech Expo USA, June 2–4 at the Long Beach Convention Center.
These packages play a crucial role in transmitting signals from commercial and government satellites and other long-range communications equipment. Engineered for compound semiconductor devices such as GaN and GaAs, the LPA-series provides ultra-low electrical loss from DC to beyond 31 GHz while efficiently pulling heat away from the die, ensuring maximum reliability in demanding RF and microwave systems.
"Our LPA-series gives designers a proven path to higher reliability and better signal integrity when the margins are extremely thin," said Casey Krawiec, VP of Sales at StratEdge. "Whether you're launching a payload into orbit or building a next-generation ground station, StratEdge packages provide the solid foundation compound semiconductor devices need to reach their full potential."
StratEdge designs and manufactures a complete line of high-frequency packages and offers a Class 1000 cleanroom, including automated gold-eutectic die attach, wedge and ball bonding, and hermetic sealing. Engineers attending either show are invited to meet with StratEdge technical staff to discuss solutions for their most challenging power and thermal requirements.
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