-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA
May 7, 2025 | StratEdgeEstimated reading time: 1 minute
StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech, taking place May 19–21 at the Hilton New Orleans Riverside, and in Booth 723 at Space Tech Expo USA, June 2–4 at the Long Beach Convention Center.
These packages play a crucial role in transmitting signals from commercial and government satellites and other long-range communications equipment. Engineered for compound semiconductor devices such as GaN and GaAs, the LPA-series provides ultra-low electrical loss from DC to beyond 31 GHz while efficiently pulling heat away from the die, ensuring maximum reliability in demanding RF and microwave systems.
"Our LPA-series gives designers a proven path to higher reliability and better signal integrity when the margins are extremely thin," said Casey Krawiec, VP of Sales at StratEdge. "Whether you're launching a payload into orbit or building a next-generation ground station, StratEdge packages provide the solid foundation compound semiconductor devices need to reach their full potential."
StratEdge designs and manufactures a complete line of high-frequency packages and offers a Class 1000 cleanroom, including automated gold-eutectic die attach, wedge and ball bonding, and hermetic sealing. Engineers attending either show are invited to meet with StratEdge technical staff to discuss solutions for their most challenging power and thermal requirements.
Suggested Items
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
Focus on electronica: Future Challenges From a Designer’s Viewpoint
01/09/2025 | I-Connect007 Editorial TeamThomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
12/02/2024 | ZESTRONZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield”
Würth Elektronik Expands Signal LED Product Range
11/21/2024 | Wurth ElectronicsWürth Elektronik expands its proven LED product series WL-SMCW and WL-SMCC with white LEDs in 0603 and 0402 packages.