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Zhen Ding Releases April 2025 Monthly Revenue Report
May 7, 2025 | Zhen Ding TechnologyEstimated reading time: Less than a minute
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported April 2025 revenue of NT$13,589 million, up 22.90% YoY, marking a record high for the same period in the company’s history. For January through April 2025, cumulative revenue reached NT$53,671 million, up 23.19% YoY, also setting a new record for the same period. These results demonstrate the company’s strong capability to maintain steady growth amid rising macroeconomic uncertainties.
According to Zhen Ding, April revenue maintained strong YoY growth, with IC Substrates showing the highest revenue growth among its four major applications, increasing by nearly 50% YoY. This was followed by Computers and Consumer Electronics segment and Mobile Communications, both achieving over 20% YoY revenue growth. While the evolving global political and economic conditions as well as fluctuations of exchange rates have posed challenges to the supply chain, Zhen Ding will continue to strengthen its global footprint and operational resilience. The company remains committed to delivering above-industry-average growth across key application areas including IC substrates, edge AI, AI servers, and optical modules, with the goal of achieve another record-high revenue this year.
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Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.