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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Technica USA Joins Supply Partner Agfa at TechBlick 2026

06/11/2026 | Technica USA
Technica USA and Agfa showcased Orgacon® and Agfa’s portfolio of conductive materials at the 2026 TechBlick Conference & Exhibition, held this week at the Computer History Museum in Mountain View, California.

Advanced Packaging: A Central Axis of Innovation in A&D, Automotive

06/11/2026 | I-Connect007 Editorial Team
Presenters in the Aerospace & Defense Special Session at APEX EXPO 2026 made one message abundantly clear: Advanced packaging has moved from a supporting role to a primary system enabler, particularly in high-reliability markets where performance, longevity, and environmental resilience are non-negotiable. The March Technical Conference at APEX EXPO focused on advanced electronics for the first time this year, with two Special Sessions featuring a carefully curated selection of presentations examining how design priorities, material choices, and manufacturing strategies are evolving in response to these demands.

Applied Materials Expands Singapore Manufacturing to Support AI Chip Demand

06/11/2026 | Applied Materials
Applied Materials, Inc., the leader in materials engineering solutions for the semiconductor industry, has expanded its manufacturing and R&D operations in Singapore to support the global build-out of AI infrastructure.

Polymatech Establishes Asia-Pacific Advanced Manufacturing Hub In Singapore

06/11/2026 | PRNewswire
AEIM Pte Ltd, a wholly owned subsidiary of Polymatech Electronics Limited, announced the opening of its advanced electronics manufacturing facility at Mapletree Hi-Tech Park, 163 Kallang Way, Singapore.

MacDermid Alpha Showcases Advanced Soldering Materials for High-Reliability Electronics Assembly at NEPCON Thailand 2026

06/11/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will present its latest materials technologies at NEPCON Thailand 2026, held June 17 to 20 at the Bangkok International Trade & Exhibition Centre (BITEC), Thailand. Recognized as a premier gathering for technology leaders and manufacturers, the event supports one of the world’s most dynamic electronics manufacturing regions.
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