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New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
May 9, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Creating the Ideal Data Package
The May 2025 issue of Design007 Magazine explores the best practices for creating the ideal data package.
There's no "one size fits all" approach to creating the perfect PCB design data package. Our expert contributors share their views on composing a complete and accurate document set ideal for your design.
Special feature: Go In-depth with… MacDermid Alpha Electronics Solutions
Ebad Rehman and Beth Turner detail the company’s latest developments in high-reliability alloys for the automotive industry.
Other highlights:
- Zero Touch Data Package: Dana Korf lays out his vision for a data package that requires as little human interaction as possible.
- Circle of Concern or Circle of Influence: John Watson explains how Stephen Covey’s “7 Habits” concept relates to designing your output package.
- From Dream House to Drill Files: As Kelly Dack notes, the PCB design environment is perfect, much like the pink world in the Barbie movie. But hard reality awaits when your design reaches the manufacturer.
- Defining the Ideal Data Output: Before creating the perfect data package, you have to define the exact requirements for your particular board.
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Rachael Temple - AlltematedSuggested Items
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Procense Raises $1.5M in Seed Funding to Accelerate AI-Powered Manufacturing
09/11/2025 | BUSINESS WIREProcense, a San Francisco-based industrial automation startup developing cutting-edge AI and remote sensing technologies for process manufacturers has raised $1.5 million in a seed funding round led by Kevin Mahaffey, Business Insider’s #1 seed investor of 2025 and HighSage Ventures, a Boston-based family office that primarily invests in public and private companies in the global software, internet, consumer, and financial technology sectors.
Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity
09/10/2025 | ZukenZuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
AI Infrastructure Boosts Global Semiconductor Revenue Growth to 17.6% in 2025
09/09/2025 | IDCAccording to the Worldwide Semiconduct o r Technology and Supply Chain Intelligence service from International Data Corporation (IDC), worldwide semiconductor revenue is expected to reach $800 billion in 2025, growing 17.6% year-over-year from $680 billion in 2024. This follows a strong rebound in 2024, when revenue grew by 22.4% year-over-year.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/05/2025 | Andy Shaughnessy, I-Connect007It’s almost fall here in Atlanta, and that means that the temperature is finally dropping. And it quit raining! It’s been raining since March, and I’m so over it, as the social influencers say. Last night we grilled out on the deck, and it wasn’t hot, and we didn’t get rained on. Life is good. It was a busy week in the industry. In this installment of my must-reads, we say goodbye to Walt Custer, the man who made PCB data points interesting for the rest of us.